Directional flow control device for a wave soldering apparatus
    1.
    发明授权
    Directional flow control device for a wave soldering apparatus 失效
    波峰焊设备的定向流量控制装置

    公开(公告)号:US5794837A

    公开(公告)日:1998-08-18

    申请号:US756128

    申请日:1996-11-25

    IPC分类号: B23K3/06

    CPC分类号: B23K3/0653

    摘要: A flow control device for a solder wave apparatus that includes an outlet or nozzle from which molten solder flows in an upward direction to contact the lower surface of a target, such as a circuit board. The flow control device provides a screen and baffle that control the flow pattern of molten solder to the nozzle so as to result in a near-parallel solder wave above the nozzle. The screen includes a pair of spaced-apart parallel panels that are disposed upstream of the nozzle. Each of the panels has apertures through which the molten solder flows before entering the nozzle. The apertures of the panels are offset from each other, such that none of the apertures are coaxial but instead overlap each other when superimposed. The baffle is disposed further upstream of the screen, and includes a number of fins disposed substantially perpendicular to the panels. The fins are arranged such that their lengths become progressively shorter in a direction away from the center of the baffle.

    摘要翻译: 一种用于焊波装置的流量控制装置,其包括熔融焊料从其向上流动以接触诸如电路板的靶的下表面的出口或喷嘴。 流量控制装置提供屏幕和挡板,其控制熔融焊料到喷嘴的流动模式,从而在喷嘴上方产生近似平行的焊料波。 屏幕包括设置在喷嘴上游的一对间隔开的平行面板。 每个面板具有孔,熔融焊料在进入喷嘴之前流过该孔。 面板的孔彼此偏移,使得没有孔是同轴的,但是当叠加时彼此重叠。 挡板设置在屏幕的更上游,并且包括大致垂直于面板设置的多个翅片。 翼片被布置成使得它们的长度在远离挡板的中心的方向上逐渐变短。