发明授权
US5795627A Method for annealing damaged semiconductor regions allowing for enhanced
oxide growth
失效
用于退火损坏的半导体区域以允许增强的氧化物生长的方法
- 专利标题: Method for annealing damaged semiconductor regions allowing for enhanced oxide growth
- 专利标题(中): 用于退火损坏的半导体区域以允许增强的氧化物生长的方法
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申请号: US799236申请日: 1997-02-14
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公开(公告)号: US5795627A公开(公告)日: 1998-08-18
- 发明人: Sunil Mehta , Emi Ishida , Xiao-Yu Li
- 申请人: Sunil Mehta , Emi Ishida , Xiao-Yu Li
- 申请人地址: CA Sunnyvale
- 专利权人: Advanced Micro Devices, Inc.
- 当前专利权人: Advanced Micro Devices, Inc.
- 当前专利权人地址: CA Sunnyvale
- 主分类号: H01L21/316
- IPC分类号: H01L21/316 ; H01L21/762 ; H01L27/115 ; C23C14/04
摘要:
A method of forming an oxide enhancing region, such as phosphorus, in a semiconductor substrate with minimal damage is provided. The method includes the steps of forming an oxide enhancing region in the semiconductor substrate to a depth below the semiconductor substrate. A 308 nm excimer laser is then applied to the oxide enhancing region in order to reduce the damage caused by forming the oxide enhancing region. A uniform and reliable oxide layer is then formed on the surface of the substrate over the damage reduced oxide enhancing region.
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