Invention Grant
US5795627A Method for annealing damaged semiconductor regions allowing for enhanced
oxide growth
失效
用于退火损坏的半导体区域以允许增强的氧化物生长的方法
- Patent Title: Method for annealing damaged semiconductor regions allowing for enhanced oxide growth
- Patent Title (中): 用于退火损坏的半导体区域以允许增强的氧化物生长的方法
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Application No.: US799236Application Date: 1997-02-14
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Publication No.: US5795627APublication Date: 1998-08-18
- Inventor: Sunil Mehta , Emi Ishida , Xiao-Yu Li
- Applicant: Sunil Mehta , Emi Ishida , Xiao-Yu Li
- Applicant Address: CA Sunnyvale
- Assignee: Advanced Micro Devices, Inc.
- Current Assignee: Advanced Micro Devices, Inc.
- Current Assignee Address: CA Sunnyvale
- Main IPC: H01L21/316
- IPC: H01L21/316 ; H01L21/762 ; H01L27/115 ; C23C14/04
Abstract:
A method of forming an oxide enhancing region, such as phosphorus, in a semiconductor substrate with minimal damage is provided. The method includes the steps of forming an oxide enhancing region in the semiconductor substrate to a depth below the semiconductor substrate. A 308 nm excimer laser is then applied to the oxide enhancing region in order to reduce the damage caused by forming the oxide enhancing region. A uniform and reliable oxide layer is then formed on the surface of the substrate over the damage reduced oxide enhancing region.
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