发明授权
- 专利标题: Electron beam source and its manufacturing method and electron beam source apparatus and electron beam apparatus using the same
- 专利标题(中): 电子束源及其制造方法和电子束源装置及使用其的电子束装置
-
申请号: US568865申请日: 1995-12-05
-
公开(公告)号: US5811819A公开(公告)日: 1998-09-22
- 发明人: Takashi Ohshima , Hiroyuki Shinada , Katsuhiro Kuroda
- 申请人: Takashi Ohshima , Hiroyuki Shinada , Katsuhiro Kuroda
- 申请人地址: JPX Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX6-320188 19941222
- 主分类号: H01J1/304
- IPC分类号: H01J1/304 ; H01J1/308 ; H01J9/02 ; H01J37/073 ; H01J37/06
摘要:
An electron beam source is provided with an electron forming means such as a doped layer of Si for forming conduction band electrons near the surface of the pointed tip of a needle-shaped structure while suppressing emission of electrons from a valence band. The surface of the pointed tip of the needle-shaped structure is formed with a single-crystal semiconductor or insulator. Preferably a surface passivation layer and/or a highly doped layer is formed on the surface of the needle-shaped structure. Also, means for exciting electrons in a valence band may be provided. An electron beam source apparatus and electron beam apparatus incorporating the electron beam source as defined above are also disclosed.
公开/授权文献
信息查询