发明授权
US5821494A Method of electrical connection between head transducer and suspension
by solder wire bumping at slider level and laser reflow
失效
头部换能器和悬架之间的电连接方法，通过焊丝在滑块级别的凸起和激光回流焊接
- 专利标题： Method of electrical connection between head transducer and suspension by solder wire bumping at slider level and laser reflow
- 专利标题（中）： 头部换能器和悬架之间的电连接方法，通过焊丝在滑块级别的凸起和激光回流焊接
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申请号： US722536申请日： 1996-09-27
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公开(公告)号： US5821494A公开(公告)日： 1998-10-13
- 发明人: David W. Albrecht , Akihiko Aoyagi , Surya Pattanaik , Yoshio Uematsu
- 申请人： David W. Albrecht , Akihiko Aoyagi , Surya Pattanaik , Yoshio Uematsu
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： G11B5/48
- IPC分类号： G11B5/48 ; H05K3/34 ; B23K26/00
摘要：
A method of making a solder connection between a slider pad and a suspension pad is provided by forming a solder bump on the solder pad at the slider level, affixing the slider to the suspension so that solder can be reflowed between the slider pad and the suspension pad and then employing a laser beam to reflow at least the solder bump to form a solder connection between the slider pad and the suspension pad. Various embodiments of the method are employed for forming the solder connection. Geometric features are also optionally incorporated in the suspension pad region of the integrated suspension that can be employed to bias the suspension pads against the solder bumps in the pre-reflow state.
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