发明授权
- 专利标题： Electronic circuit device
- 专利标题（中）： 电子电路装置
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申请号： US962882申请日： 1997-11-05
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公开(公告)号： US5821627A公开(公告)日： 1998-10-13
- 发明人: Miki Mori , Yukio Kizaki , Takaaki Yasumoto , Koji Yamakawa , Masayuki Saito , Tatsuro Uchida , Takasi Togasaki , Takashi Yebisuya , Taijun Murakami
- 申请人： Miki Mori , Yukio Kizaki , Takaaki Yasumoto , Koji Yamakawa , Masayuki Saito , Tatsuro Uchida , Takasi Togasaki , Takashi Yebisuya , Taijun Murakami
- 申请人地址： JPX Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX5-051119 19930311; JPX5-216805 19930901; JPX5-232871 19930920; JPX6-319860 19941222
- 主分类号： H05K3/32
- IPC分类号： H05K3/32 ; H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
An electronic circuit device includes a substrate, a wiring layer formed on the surface of the substrate and essentially consisting of at least one metal selected from the group consisting of gold, copper, tin, and aluminum, a bump formed on the wiring layer and essentially consisting of at least one metal selected from the group consisting of gold, copper, and aluminum, and a micro electronic element formed on the bump, wherein solid-phase diffusion bonding is performed at least either between the wiring layer and the bump or between the bump and an electrode of the micro electronic element.
公开/授权文献
- US5275519A Anchor bolt 公开/授权日：1994-01-04
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