公开(公告)号：US5821627A

公开(公告)日：1998-10-13

申请号：US962882

申请日：1997-11-05

申请人： Miki Mori ,  Yukio Kizaki ,  Takaaki Yasumoto ,  Koji Yamakawa ,  Masayuki Saito ,  Tatsuro Uchida ,  Takasi Togasaki ,  Takashi Yebisuya ,  Taijun Murakami

发明人： Miki Mori ,  Yukio Kizaki ,  Takaaki Yasumoto ,  Koji Yamakawa ,  Masayuki Saito ,  Tatsuro Uchida ,  Takasi Togasaki ,  Takashi Yebisuya ,  Taijun Murakami

IPC分类号： H05K3/32 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/328 ,  H01L2224/1134 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611

摘要： An electronic circuit device includes a substrate, a wiring layer formed on the surface of the substrate and essentially consisting of at least one metal selected from the group consisting of gold, copper, tin, and aluminum, a bump formed on the wiring layer and essentially consisting of at least one metal selected from the group consisting of gold, copper, and aluminum, and a micro electronic element formed on the bump, wherein solid-phase diffusion bonding is performed at least either between the wiring layer and the bump or between the bump and an electrode of the micro electronic element.

摘要翻译： 电子电路装置包括：基板，形成在基板的表面上的基本上由布线层形成的凸块和基本上由金，铜，锡和铝组成的组中的至少一种金属组成的布线层; 由选自金，铜和铝的至少一种金属和形成在凸块上的微电子元件组成，其中固定相扩散接合至少在布线层和凸块之间或者在 凸块和微电子元件的电极。

公开(公告)号：US5907187A

公开(公告)日：1999-05-25

申请号：US502587

申请日：1995-07-14

申请人： Kaoru Koiwa ,  Koji Yamakawa ,  Kiyoshi Iyogi ,  Takaaki Yasumoto ,  Nobuo Iwase

发明人： Kaoru Koiwa ,  Koji Yamakawa ,  Kiyoshi Iyogi ,  Takaaki Yasumoto ,  Nobuo Iwase

IPC分类号： H01L23/498 ,  H05K3/34 ,  H01L23/48 ,  H01L23/06 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K2201/094 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K3/3463 ,  H05K3/3484 ,  Y02P70/613

摘要： In such electronic components as semiconductor packages and semiconductor chips which are possessed of groups of connecting bumps as input and output terminals, the groups of connecting bumps comprise not less than two kinds of connecting bumps different in melting point or not less than two kinds of connecting bumps different in mechanical strength. The groups of connecting bumps comprise connecting bumps made of high temperature solder or connecting bumps made of a high strength In type solder in the part of formation thereof. The connecting bumps made of high temperature solder are not directly affected by the influence of displacement because they retain the shape of a ball even after the step of connection such as solder reflow. The connecting bumps made of In type solder form connecting parts of high strength. These groups of connecting bumps contribute to exalt the reliability of the connecting parts without decreasing the number of input and output terminals.

摘要翻译： 在具有作为输入和输出端子的连接凸块组的半导体封装和半导体芯片的这种电子部件中，连接凸块组包括不少于两种不同熔点的连接凸块或不少于两种连接 不同的机械强度凸起。 连接凸块的组包括在其形成部分中由高温焊料或由高强度In型焊料制成的连接凸块形成的连接凸块。 由高温焊料制成的连接凸块不受位移影响的直接影响，因为即使在诸如焊料回流的连接步骤之后，它们保持了球的形状。 由In型焊料形成的连接凸块形成高强度的连接部件。 这些连接凸块组有助于提高连接部件的可靠性，而不会减少输入和输出端子的数量。

公开(公告)号：US5326623A

公开(公告)日：1994-07-05

申请号：US10298

申请日：1993-01-28

申请人： Koji Yamakawa ,  Kaoru Koiwa ,  Takaaki Yasumoto ,  Kiyoshi Iyogi ,  Nobuo Iwase

发明人： Koji Yamakawa ,  Kaoru Koiwa ,  Takaaki Yasumoto ,  Kiyoshi Iyogi ,  Nobuo Iwase

IPC分类号： C04B37/02 ,  H01L23/12 ,  H01L23/15 ,  H01L23/498 ,  H01L23/538 ,  H05K1/09 ,  H05K3/24 ,  B32B9/00

CPC分类号： H01L23/538 ,  H01L23/49866 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A circuit board including a circuit pattern adhered firmly to a ceramic substrate and capable of eliminating an increase in resistivity due to an influence of an external environment, particularly, a thermal influence is disclosed. The circuit board comprises a ceramic substrate, and a circuit pattern formed on the substrate and having a multilayered structure in which a bonding layer comprising Ti and at least one element selected from the group consisting of N and O, a conductor layer consisting essentially of Cu, and a protective layer comprising Ti and at least one element selected from the group consisting of N and O are stacked in the order named.

摘要翻译： 公开了一种电路板，其包括牢固地粘附在陶瓷基板上的电路图形，能够消除由外部环境的影响引起的电阻率的增加，特别是热影响。 电路板包括陶瓷基板和形成在基板上并具有多层结构的电路图案，其中包含Ti和至少一种选自N和O的元素的接合层，基本上由Cu组成的导体层 ，并且以所述顺序堆叠包含Ti和从N和O组成的组中选择的至少一种元素的保护层。

公开(公告)号：US5622769A

公开(公告)日：1997-04-22

申请号：US194495

申请日：1994-02-10

申请人： Shoji Kozuka ,  Masaru Hayashi ,  Katsuyoshi Oh-Ishi ,  Takaaki Yasumoto ,  Nobuo Iwase ,  Hiroshi Endo ,  Koji Yamakawa ,  Kaoru Koiwa ,  Kiyoshi Iyogi

发明人： Shoji Kozuka ,  Masaru Hayashi ,  Katsuyoshi Oh-Ishi ,  Takaaki Yasumoto ,  Nobuo Iwase ,  Hiroshi Endo ,  Koji Yamakawa ,  Kaoru Koiwa ,  Kiyoshi Iyogi

IPC分类号： H01L23/15 ,  H05K1/03 ,  H05K3/38 ,  B32B3/00

CPC分类号： H05K3/38 ,  H01L23/15 ,  H01L2924/0002 ,  H05K1/0306 ,  Y10S428/901 ,  Y10T428/24917

摘要： According to this invention, there is disclosed a thermal conductivity substrate which includes an aluminum nitride sintered body and a coating layer formed on the body of aluminum phosphate and having a surface roughness of 1 .mu.m or less, and which has excellent humidity resistance and chemical resistance.

摘要翻译： 根据本发明，公开了一种导热性基材，其包括氮化铝烧结体和形成在磷酸铝体上的表面粗糙度为1μm以下并且具有优异的耐湿性和化学性质的涂层 抵抗性。

公开(公告)号：US5412160A

公开(公告)日：1995-05-02

申请号：US212869

申请日：1994-03-15

申请人： Takaaki Yasumoto ,  Nobuo Iwase ,  Kaoru Koiwa ,  Koji Yamakawa ,  Kiyoshi Iyogi

发明人： Takaaki Yasumoto ,  Nobuo Iwase ,  Kaoru Koiwa ,  Koji Yamakawa ,  Kiyoshi Iyogi

IPC分类号： H01L23/373 ,  H05K1/02 ,  H05K1/00

CPC分类号： H01L23/3731 ,  H01L23/3732 ,  H01L23/3733 ,  H05K1/024 ,  H05K3/4605 ,  H05K3/467 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2201/0179

摘要： A circuit board comprising a substrate, at least one dielectric film formed on the substrate and made of at least one selected from the group consisting of AlN, BN, diamond, diamond-like carbon, BeO and SiC, the dielectric film having pores of a porosity of 5 to 95% by volume, and at least one wiring metal film formed on the dielectric film.

摘要翻译： 一种电路板，包括基板，至少一个电介质膜，形成在基板上，由选自AlN，BN，金刚石，类金刚石碳，BeO和SiC中的至少一种制成，电介质膜具有孔 5〜95体积％的孔隙率和形成在电介质膜上的至少一个布线金属膜。

公开(公告)号：US20090033177A1

公开(公告)日：2009-02-05

申请号：US10582229

申请日：2006-03-29

申请人： Kazuhiko Itaya ,  Ryoichi Ohara ,  Kenya Sano ,  Takaaki Yasumoto ,  Naoko Yanase

发明人： Kazuhiko Itaya ,  Ryoichi Ohara ,  Kenya Sano ,  Takaaki Yasumoto ,  Naoko Yanase

IPC分类号： H01L41/047 ,  H01L41/22

CPC分类号： H03H9/132 ,  H03H3/02 ,  H03H9/02118 ,  H03H9/13 ,  H03H9/174 ,  Y10T29/42

摘要： A thin film piezoelectric resonator includes a substrate having a cavity; a first electrode extending over the cavity; a piezoelectric film placed on the first electrode; and a second electrode placed on the piezoelectric film, the second electrode having a periphery partially overlapping on the cavity and tapered to have an inner angle of 30 degrees or smaller defined by a part of the periphery thereof and a bottom thereof.

摘要翻译： 薄膜压电谐振器包括具有空腔的基板; 在空腔上延伸的第一电极; 放置在第一电极上的压电薄膜; 以及放置在所述压电膜上的第二电极，所述第二电极具有在所述空腔上部分重叠的周边，并且具有锥形以具有由其周边的一部分及其底部限定的30度或更小的内角。

公开(公告)号：US07268647B2

公开(公告)日：2007-09-11

申请号：US11626270

申请日：2007-01-23

申请人： Kenya Sano ,  Naoko Yanase ,  Kazuhiko Itaya ,  Takaaki Yasumoto ,  Ryoichi Ohara ,  Takashi Kawakubo ,  Takako Motai

发明人： Kenya Sano ,  Naoko Yanase ,  Kazuhiko Itaya ,  Takaaki Yasumoto ,  Ryoichi Ohara ,  Takashi Kawakubo ,  Takako Motai

IPC分类号： H03H9/15 ,  H03H9/13 ,  H03H3/02 ,  H03H9/54

CPC分类号： H03H3/02 ,  H03H9/173 ,  H03H9/174 ,  H03H9/605 ,  Y10T29/42

摘要： A film bulk acoustic-wave resonator having, a substrate having a cavity, the substrate being formed of one of semi-insulating material and high-resistivity material, a bottom electrode partially fixed to the substrate, part of the bottom electrode is mechanically suspended above the cavity, a piezoelectric layer disposed on the bottom electrode, the shape of the piezoelectric layer is defined by a contour, a top electrode on the piezoelectric layer, a semiconductor intermediate electrode buried at and in a surface of the substrate, being located at the contour of the piezoelectric layer, the semiconductor region having a lower resistivity than the substrate, the intermediate electrode is connected to the bottom electrode in the inside of the contour, and a bottom electrode wiring connected to the semiconductor intermediate electrode extending from the contour to an outside of the contour in the plan view.

摘要翻译： 一种薄膜体声波谐振器，具有具有空腔的基板，所述基板由半绝缘材料和高电阻率材料中的一种形成，底部电极部分地固定到所述基板，所述底部电极的一部分机械地悬挂在 空腔，设置在底部电极上的压电层，压电层的形状由轮廓限定，压电层上的顶部电极，埋在基底表面的表面的半导体中间电极位于 压电层的轮廓，半导体区域具有比衬底低的电阻率，中间电极在轮廓内部连接到底部电极，并且连接到从轮廓延伸到半导体中间电极的底部电极配线 在平面视图外的轮廓外。

公开(公告)号：US20070115078A1

公开(公告)日：2007-05-24

申请号：US11626270

申请日：2007-01-23

申请人： Kenya Sano ,  Naoko Yanase ,  Kazuhiko Itaya ,  Takaaki Yasumoto ,  Ryoichi Ohara ,  Takashi Kawakubo ,  Takako Motai

发明人： Kenya Sano ,  Naoko Yanase ,  Kazuhiko Itaya ,  Takaaki Yasumoto ,  Ryoichi Ohara ,  Takashi Kawakubo ,  Takako Motai

IPC分类号： H03H9/54

CPC分类号： H03H3/02 ,  H03H9/173 ,  H03H9/174 ,  H03H9/605 ,  Y10T29/42

摘要： A film bulk acoustic-wave resonator having, a substrate having a cavity, the substrate being formed of one of semi-insulating material and high-resistivity material, a bottom electrode partially fixed to the substrate, part of the bottom electrode is mechanically suspended above the cavity, a piezoelectric layer disposed on the bottom electrode, the shape of the piezoelectric layer is defined by a contour, a top electrode on the piezoelectric layer, a semiconductor intermediate electrode buried at and in a surface of the substrate, being located at the contour of the piezoelectric layer, the semiconductor region having a lower resistivity than the substrate, the intermediate electrode is connected to the bottom electrode in the inside of the contour, and a bottom electrode wiring connected to the semiconductor intermediate electrode extending from the contour to an outside of the contour in the plan view.

摘要翻译： 一种薄膜体声波谐振器，具有具有空腔的基板，所述基板由半绝缘材料和高电阻率材料中的一种形成，底部电极部分地固定到所述基板，所述底部电极的一部分机械地悬挂在 空腔，设置在底部电极上的压电层，压电层的形状由轮廓限定，压电层上的顶部电极，埋在基底表面的表面的半导体中间电极位于 压电层的轮廓，半导体区域具有比衬底低的电阻率，中间电极在轮廓内部连接到底部电极，并且连接到从轮廓延伸到半导体中间电极的底部电极配线 在平面视图外的轮廓外。

公开(公告)号：US07187253B2

公开(公告)日：2007-03-06

申请号：US11108671

申请日：2005-04-19

申请人： Kenya Sano ,  Naoko Yanase ,  Kazuhiko Itaya ,  Takaaki Yasumoto ,  Ryoichi Ohara ,  Takashi Kawakubo ,  Takako Motai

发明人： Kenya Sano ,  Naoko Yanase ,  Kazuhiko Itaya ,  Takaaki Yasumoto ,  Ryoichi Ohara ,  Takashi Kawakubo ,  Takako Motai

IPC分类号： H03H9/54 ,  H03H3/02

CPC分类号： H03H3/02 ,  H03H9/173 ,  H03H9/174 ,  H03H9/605 ,  Y10T29/42

摘要： A film bulk acoustic-wave resonator encompasses (a) a substrate having a cavity, (b) a bottom electrode partially fixed to the substrate, part of the bottom electrode is mechanically suspended above the cavity, (c) a piezoelectric layer disposed on the bottom electrode, a planar shape of the piezoelectric layer is defined by a contour, which covers an entire surface of the bottom electrode in a plan view, (d) a top electrode on the piezoelectric layer, (e) an intermediate electrode located between the substrate and the piezoelectric layer, and at the contour of the piezoelectric layer, the intermediate electrode is connected to the bottom electrode in the inside of the contour, and (f) a bottom electrode wiring connected to the intermediate electrode extending from the contour to an outside of the contour in the plan view, wherein a longitudinal vibration mode along a thickness direction of the piezoelectric layer is utilized.

摘要翻译： 薄膜体声波谐振器包括（a）具有空腔的基板，（b）部分地固定到基板的底部电极，底部电极的一部分机械地悬挂在空腔上方，（c）压电层， 底部电极，压电层的平面形状由在平面图中覆盖底部电极的整个表面的轮廓限定，（d）压电层上的顶部电极，（e）中间电极，位于 衬底和压电层，并且在压电层的轮廓处，中间电极在轮廓的内部连接到底部电极，（f）连接到从轮廓延伸到中间电极的底部电极配线 在平面图的轮廓外侧，利用沿着压电体层的厚度方向的纵向振动模式。

公开(公告)号：US5041700A

公开(公告)日：1991-08-20

申请号：US588928

申请日：1990-09-27

申请人： Kiyoshi Iyogi ,  Takaaki Yasumoto ,  Toshirou Yanazawa ,  Nobuo Iwase

发明人： Kiyoshi Iyogi ,  Takaaki Yasumoto ,  Toshirou Yanazawa ,  Nobuo Iwase

IPC分类号： C04B37/02 ,  C04B41/52 ,  C04B41/89 ,  H01L23/15 ,  H01L23/498 ,  H05K1/03 ,  H05K3/38

CPC分类号： C04B41/009 ,  C04B41/52 ,  C04B41/89 ,  H01L23/15 ,  H01L23/49866 ,  H01L2924/0002 ,  H01L2924/15312 ,  H05K1/0306 ,  H05K3/38

摘要： A circuit board includes an aluminum nitride substrate, and a circuit pattern formed on the substrate and having a multilayered structure in which a metal oxynitride layer represented by formula Al.sub.u Ml.sub.v M2.sub.x O.sub.y N.sub.z (wherein M1 represents a metal selected from the group consisting of Ti, Cr, Ta, and Zr, M2 represents a metal selected from the group consisting of Ni, Pt, Pd, W, Nb, and Mo, u represents 3 to 50 atm %, v represents 3 to 78 atm %, x represents 0 to 50 atm %, y represents 0.005 to 25 atm %, and z represents 5 to 70 atm %), a bonding layer consisting essentially of a metal represented by M1, a barrier layer consisting essentially of a metal represented by M2, and a conductor layer consisting essentially of Au are stacked in the order named.

摘要翻译： 电路板包括氮化铝衬底和形成在衬底上并具有多层结构的电路图案，其中由式AluMlvM2xOyNz表示的金属氧氮化物层（其中M1表示选自Ti，Cr，Ta， Zr，M2表示选自Ni，Pt，Pd，W，Nb和Mo的金属，u表示3〜50atm％，v表示3〜78atm％，x表示0〜50atm％ y表示0.005〜25atm％，z表示5〜70atm％），基本上由M1表示的金属构成的接合层，基本上由M2表示的金属构成的阻挡层和基本上由Au构成的导体层 按照命名的顺序堆叠。