公开(公告)号：US5821627A

公开(公告)日：1998-10-13

申请号：US962882

申请日：1997-11-05

申请人： Miki Mori ,  Yukio Kizaki ,  Takaaki Yasumoto ,  Koji Yamakawa ,  Masayuki Saito ,  Tatsuro Uchida ,  Takasi Togasaki ,  Takashi Yebisuya ,  Taijun Murakami

发明人： Miki Mori ,  Yukio Kizaki ,  Takaaki Yasumoto ,  Koji Yamakawa ,  Masayuki Saito ,  Tatsuro Uchida ,  Takasi Togasaki ,  Takashi Yebisuya ,  Taijun Murakami

IPC分类号： H05K3/32 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/328 ,  H01L2224/1134 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611

摘要： An electronic circuit device includes a substrate, a wiring layer formed on the surface of the substrate and essentially consisting of at least one metal selected from the group consisting of gold, copper, tin, and aluminum, a bump formed on the wiring layer and essentially consisting of at least one metal selected from the group consisting of gold, copper, and aluminum, and a micro electronic element formed on the bump, wherein solid-phase diffusion bonding is performed at least either between the wiring layer and the bump or between the bump and an electrode of the micro electronic element.

摘要翻译： 电子电路装置包括：基板，形成在基板的表面上的基本上由布线层形成的凸块和基本上由金，铜，锡和铝组成的组中的至少一种金属组成的布线层; 由选自金，铜和铝的至少一种金属和形成在凸块上的微电子元件组成，其中固定相扩散接合至少在布线层和凸块之间或者在 凸块和微电子元件的电极。

公开(公告)号：US5684677A

公开(公告)日：1997-11-04

申请号：US688677

申请日：1996-07-29

申请人： Tatsuro Uchida ,  Takashi Yebisuya ,  Miki Mori ,  Masayuki Saito ,  Takasi Togasaki ,  Yukio Kizaki

发明人： Tatsuro Uchida ,  Takashi Yebisuya ,  Miki Mori ,  Masayuki Saito ,  Takasi Togasaki ,  Yukio Kizaki

IPC分类号： H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K7/02 ,  H05K7/10 ,  H05K1/16

CPC分类号： H05K3/303 ,  H05K3/3442 ,  H01L2224/10165 ,  H01L2224/8114 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10727 ,  H05K2203/0465 ,  H05K2203/0568 ,  H05K2203/167 ,  H05K2203/306 ,  H05K3/3452 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic circuit device comprising a printed wiring board having a major surface and pads provided on the major surface of the printed wiring board, a plurality of electrodes provided partly on at least one major surface of the leadless component and partly on sides of the leadless component, a plurality of bumps provided on the pads, providing a gap between the major surface of the printed wiring board and the major surface of the leadless component, and electrically connecting those parts of the electrodes which are provided on the major surface of the leadless component to the pads, and a plurality of electrically conductive members integral with the bumps, extending from the bumps to those parts of the electrodes which are provided on the sides of the leadless component.

摘要翻译： 一种电子电路装置，包括具有主表面的印刷线路板和设置在印刷线路板的主表面上的焊盘，多个电极部分地设置在无引线元件的至少一个主表面上，部分地设置在无引线元件的侧面上 设置在所述焊盘上的多个凸块，在所述印刷电路板的所述主表面和所述无引线部件的主表面之间提供间隙，以及电连接设置在所述无引线部件的主表面上的所述电极部分 并且与凸块成一体的多个导电部件从凸块延伸到设置在无引线部件的侧面上的电极部分。

公开(公告)号：US5801797A

公开(公告)日：1998-09-01

申请号：US816725

申请日：1997-03-13

申请人： Atsuko Iida ,  Tatsuro Uchida ,  Akira Kinno ,  Masayuki Saito ,  Yukio Kizaki ,  Takeshi Miyagi ,  Miki Mori ,  Yumi Fukuda

发明人： Atsuko Iida ,  Tatsuro Uchida ,  Akira Kinno ,  Masayuki Saito ,  Yukio Kizaki ,  Takeshi Miyagi ,  Miki Mori ,  Yumi Fukuda

IPC分类号： G02F1/1333 ,  G02F1/1347 ,  G02F1/1362 ,  G02F1/133 ,  G02F1/1339 ,  G02F1/1343

CPC分类号： G02F1/13336 ,  G02F1/13452 ,  G02F1/1347

摘要： The image display apparatus is capable of displaying an image on a large screen in which non-display regions are completely eliminated or minimized. The image display apparatus comprises an opposite board in which common electrodes made of transparent conductive resin are respectively formed on both surfaces of a transparent substrate. A plurality of array boards in each of which semiconductor element and a signal line are formed on a transparent substrate are arranged on both surfaces of the opposite board, such that display regions of end portions of the array boards face each other a sandwich of the opposite board inserted therebetween. Frame-like sealing members made of transparent resin are respectively inserted in clearances between the opposite board and the array boards. Liquid crystal is enclosed in each of spaces surrounded by the frame-like sealing members between the opposite board and the array boards.

摘要翻译： 图像显示装置能够在大屏幕上显示图像，其中非显示区域被完全消除或最小化。 图像显示装置包括在透明基板的两个表面上分别形成由透明导电树脂制成的公共电极的相对板。 在透明基板上形成有多个阵列基板的半导体元件和信号线形成在对置基板的两面上，使得阵列板的端部的显示区域彼此面对相反的三明治 板插入其间。 由透明树脂制成的框状密封件分别插入相对的板和阵列板之间的间隙中。 液晶被封闭在由相对板和阵列板之间的框状密封构件包围的每个空间中。

公开(公告)号：US5959363A

公开(公告)日：1999-09-28

申请号：US93728

申请日：1998-06-09

申请人： Hiroshi Yamada ,  Takasi Togasaki ,  Masayuki Saito ,  Soichi Honma ,  Miki Mori ,  Kazuki Tateyama

发明人： Hiroshi Yamada ,  Takasi Togasaki ,  Masayuki Saito ,  Soichi Honma ,  Miki Mori ,  Kazuki Tateyama

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/60 ,  H01L23/28

CPC分类号： H01L23/3135 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29034 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83051 ,  H01L2224/83102 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3511

摘要： A semiconductor device comprising a wiring circuit board and a semiconductor chip mounted through a bump electrode on the circuit board, a space between the circuit board and the semiconductor chip as well as a periphery of the semiconductor chip being encapsulated with a resin containing a filler. The resin is constituted by a first resin disposed in a region surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, and by a second resin disposed in a region not surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, the first and second resins being distinct from each other in at least one feature selected from a content, a maximum particle diameter and an average particle diameter of the filler.

公开(公告)号：US5864178A

公开(公告)日：1999-01-26

申请号：US580978

申请日：1996-01-03

申请人： Hiroshi Yamada ,  Takasi Togasaki ,  Masayuki Saito ,  Soichi Honma ,  Miki Mori ,  Kazuki Tateyama

发明人： Hiroshi Yamada ,  Takasi Togasaki ,  Masayuki Saito ,  Soichi Honma ,  Miki Mori ,  Kazuki Tateyama

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/60 ,  H01L23/28

CPC分类号： H01L23/3135 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29034 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83051 ,  H01L2224/83102 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/15151 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/3511

摘要： A semiconductor device comprising a wiring circuit board and a semiconductor chip mounted through a bump electrode on the circuit board, a space between the circuit board and the semiconductor chip as well as a periphery of the semiconductor chip being encapsulated with a resin containing a filler. The resin is constituted by a first resin disposed in a region surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, and by a second resin disposed in a region not surrounded by bump electrodes positioned on the outermost periphery of the semiconductor chip, the first and second resins being distinct from each other in at least one feature selected from a content, a maximum particle diameter and an average particle diameter of the filler.

摘要翻译： 一种半导体器件，包括布线电路板和通过电路板上的凸块电极安装的半导体芯片，电路板和半导体芯片之间的空间以及半导体芯片的外围被包含填料的树脂封装。 该树脂由设置在位于半导体芯片的最外周上的凸起电极包围的区域中的第一树脂，以及设置在不包围位于半导体芯片的最外周边的凸块电极的区域中的第二树脂构成， 第一和第二树脂在选自填料的含量，最大粒径和平均粒径的至少一个特征中彼此不同。

公开(公告)号：US5448114A

公开(公告)日：1995-09-05

申请号：US389743

申请日：1995-02-15

申请人： You Kondoh ,  Masayuki Saito ,  Takasi Togasaki

发明人： You Kondoh ,  Masayuki Saito ,  Takasi Togasaki

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/10 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H01L29/60

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L23/10 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1147 ,  H01L2224/13111 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/291 ,  H01L2224/30155 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15312 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/351

摘要： A semiconductor device contains a semiconductor chip and a circuit board. The chip has a first surface at which the main region is formed. On the surface, a plurality of chip electrodes and a perimeter electrode surrounding the chip electrodes are formed. Bumps and a wall member made of solder metal are formed on the chip electrodes and frame-shaped electrode, respectively. The circuit board has a first surface facing the first surface of the chip. On the first surface of the circuit board, a plurality of board electrodes and a perimeter electrode are placed so as to correspond to the chip electrodes and the perimeter electrode. In a state where the chip and the board face each other, heat treatment is performed to connect the bumps and wall member to the board simultaneously by reflow. The wall member connects the chip to the board while surrounding the main region and the bumps continuously, to form essentially a closed space between the chip and the board.

摘要翻译： 半导体器件包含半导体芯片和电路板。 芯片具有形成主区域的第一表面。 在表面上，形成有多个芯片电极和围绕芯片电极的周边电极。 在芯片电极和框架状电极上分别形成有由焊料金属制成的凸块和壁构件。 电路板具有面向芯片的第一表面的第一表面。 在电路板的第一表面上，放置多个基板电极和周边电极以对应于芯片电极和周边电极。 在芯片和电路板彼此面对的状态下，进行热处理，以通过回流同时将凸块和壁构件连接到电路板。 壁构件将芯片连接到板上，同时围绕主区域和凸块连续地形成，以在芯片和板之间基本形成封闭空间。

公开(公告)号：US06626724B2

公开(公告)日：2003-09-30

申请号：US10234151

申请日：2002-09-05

申请人： Masahiko Yamamoto ,  Miki Mori ,  Yumi Fukuda ,  Hitoshi Kobayashi ,  Yujiro Hara ,  Goh Itoh ,  Masayuki Saito ,  Toshiro Hiraoka ,  Koji Asakawa

发明人： Masahiko Yamamoto ,  Miki Mori ,  Yumi Fukuda ,  Hitoshi Kobayashi ,  Yujiro Hara ,  Goh Itoh ,  Masayuki Saito ,  Toshiro Hiraoka ,  Koji Asakawa

IPC分类号： H01J926

CPC分类号： H01J1/3042 ,  H01J9/025 ,  H01J9/185

摘要： A display device has an array formed on a substrate including a cathode wiring line layer, a gate wiring line layer and an insulating layer for electrically insulating the cathode wiring line layer and the gate wiring line layer from each other. Holes are formed at the crossing portion between the cathode wiring line layer and the gate wiring line layer so as to penetrate through the insulating layer, and resistive layer and an emitter layer are provided in the holes. The resistive layer has such a structure that conductive fine particles are dispersed in a base material of insulating fine particles, and the emitter layer is formed of a fine particle material. The insulating layer between the cathode electrode lines and the gate electrodes is formed of a silicon oxide film containing fluorine. When a large number of elements are formed over a large area in an electron emission device using fine particle emitters, there can be provided electron emission elements which can suppress the unevenness of the electron emission amount. According to the present invention, there can be provided a large-area and uniform display device which can be operated with a low driving voltage, and have a long lifetime.

摘要翻译： 显示装置具有形成在包括阴极布线线层，栅极布线线层和绝缘层的基板上的阵列，用于使阴极布线层和栅极布线层彼此电绝缘。 在阴极布线层和栅极布线层之间的交叉部分处形成孔，以穿透绝缘层，并且在孔中设置电阻层和发射极层。 电阻层具有将导电性细颗粒分散在绝缘性细颗粒的基材中的结构，发射极层由细粒材料形成。 阴极电极线和栅电极之间的绝缘层由含氟的氧化硅膜形成。 当使用细粒子发射体的电子发射装置中，在大面积上形成大量的元件时，可以提供能够抑制电子发射量不均匀的电子发射元件。 根据本发明，可以提供一种能够以低驱动电压操作并且寿命长的大面积均匀的显示装置。

公开(公告)号：US06563260B1

公开(公告)日：2003-05-13

申请号：US09525531

申请日：2000-03-15

申请人： Masahiko Yamamoto ,  Miki Mori ,  Yumi Fukuda ,  Hitoshi Kobayashi ,  Yujiro Hara ,  Goh Itoh ,  Masayuki Saito ,  Toshiro Hiraoka ,  Koji Asakawa

发明人： Masahiko Yamamoto ,  Miki Mori ,  Yumi Fukuda ,  Hitoshi Kobayashi ,  Yujiro Hara ,  Goh Itoh ,  Masayuki Saito ,  Toshiro Hiraoka ,  Koji Asakawa

IPC分类号： H01J162

CPC分类号： H01J1/3042 ,  H01J9/025 ,  H01J9/185

摘要： A display device has an array formed on a substrate including a cathode wiring line layer, a gate wiring line layer and an insulating layer for electrically insulating the cathode wiring line layer and the gate wiring line layer from each other. Holes are formed at the crossing portion between the cathode wiring line layer and the gate wiring line layer so as to penetrate through the insulating layer, and resistive layer and an emitter layer are provided in the holes. The resistive layer has such a structure that conductive fine particles are dispersed in a base material of insulating fine particles, and the emitter layer is formed of a fine particle material. The insulating layer between the cathode electrode lines and the gate electrodes is formed of a silicon oxide film containing fluorine. When a large number of elements are formed over a large area in an electron emission device using fine particle emitters, there can be provided electron emission elements which can suppress the unevenness of the electron emission amount. According to the present invention, there can be provided a large-area and uniform display device which can be operated with a low driving voltage, and have a long lifetime.

摘要翻译： 显示装置具有形成在包括阴极布线线层，栅极布线线层和绝缘层的基板上的阵列，用于使阴极布线层和栅极布线层彼此电绝缘。 在阴极布线层和栅极布线层之间的交叉部分处形成孔，以穿透绝缘层，并且在孔中设置电阻层和发射极层。 电阻层具有将导电性细颗粒分散在绝缘性细颗粒的基材中的结构，发射极层由细粒材料形成。 阴极电极线和栅电极之间的绝缘层由含氟的氧化硅膜形成。 当使用细粒子发射体的电子发射装置中，在大面积上形成大量的元件时，可以提供能够抑制电子发射量不均匀的电子发射元件。 根据本发明，可以提供一种能够以低驱动电压操作并且寿命长的大面积均匀的显示装置。

公开(公告)号：US06603256B1

公开(公告)日：2003-08-05

申请号：US09526468

申请日：2000-03-15

申请人： Goh Itoh ,  Haruhiko Okumura ,  Miki Mori ,  Yumi Fukuda ,  Hisao Fujiwara ,  Yujiro Hara ,  Hitoshi Kobayashi ,  Masahiko Yamamoto ,  Masayuki Saito ,  Masayuki Nakamoto

发明人： Goh Itoh ,  Haruhiko Okumura ,  Miki Mori ,  Yumi Fukuda ,  Hisao Fujiwara ,  Yujiro Hara ,  Hitoshi Kobayashi ,  Masahiko Yamamoto ,  Masayuki Saito ,  Masayuki Nakamoto

IPC分类号： H01J6304

CPC分类号： G09G3/2011 ,  G09G3/2014 ,  G09G3/2074 ,  G09G3/2077 ,  G09G3/22 ,  H01J29/04 ,  H01J31/127

摘要： There is provided a field emission type display which is capable of suppressing deterioration of image quality which otherwise occurs due to stepwise cuts and to the increase of wiring resistance caused by a thin width of a cathode line and which causes less failures. The display includes a plurality of cathode lines having an equal line width within the pixel and is structurally based on a multiple gradation representing a scheme of controlling spatial gradation display by changing the number of field emission type emitters to be driven by changing the number of cathode lines to be selected.

摘要翻译： 提供了一种场致发射型显示器，其能够抑制由于逐步切割而导致的图像质量的劣化以及由阴极线的薄宽度引起的布线电阻的增加，并且导致较少的故障。 显示器包括在像素内具有相等的线宽的多个阴极线，并且在结构上是基于多个灰度，表示通过改变要驱动的场发射型发射器的数量来控制空间灰度显示的方案，通过改变阴极数 要选择的行

公开(公告)号：US5071787A

公开(公告)日：1991-12-10

申请号：US477504

申请日：1990-02-09

申请人： Miki Mori ,  Masayuki Saito

发明人： Miki Mori ,  Masayuki Saito

IPC分类号： B23K35/00 ,  H01L21/56 ,  H01L21/603 ,  H01L23/485

CPC分类号： H01L24/11 ,  B23K35/001 ,  H01L21/563 ,  H01L24/13 ,  H01L24/28 ,  H01L24/81 ,  H01L2224/11003 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81409 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  Y10T29/49144

摘要： In a semiconductor device including a substrate having a wiring layer formed on its major surface and a semiconductor element having an electrode formed on its major surface in which a face-down bonding is achieved with the major surface of the semiconductor element oppositely facing that major surface of the semiconductor substrate which is located opposite to the electrode on the semiconductor element, first bumps formed of gold are formed on the electrode of the semiconductor element, second bumps formed of an indium/tin alloy are formed on the first bumps and an electrical and mechanical bond is achieved, by the second bumps, between the first bumps and the wiring layer in which case the second bumps are heated to an extent not exceeding the melting point of the second bumps.