发明授权
- 专利标题： Method of manufacturing semiconductor mirror wafers
- 专利标题（中）： 制造半导体镜片晶圆的方法
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申请号： US684000申请日： 1996-07-19
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公开(公告)号： US5827779A公开(公告)日： 1998-10-27
- 发明人: Hisashi Masumura , Kiyoshi Suzuki , Hideo Kudo
- 申请人： Hisashi Masumura , Kiyoshi Suzuki , Hideo Kudo
- 申请人地址： JPX Shiyoda-ku
- 专利权人： Shin-Etsu Handotai Co. Ltd.
- 当前专利权人： Shin-Etsu Handotai Co. Ltd.
- 当前专利权人地址： JPX Shiyoda-ku
- 优先权： JPX7-207514 19950721; JPX8-204311 19960715
- 主分类号： B24B37/07
- IPC分类号： B24B37/07 ; B24B37/20 ; B24B37/24 ; C30B33/00 ; H01L21/304 ; H01L21/44
摘要：
A method of manufacturing semiconductor mirror wafers includes a double side primary mirror polishing step and a single side final mirror polishing step. The method having the double side mirror polishing step is capable of higher flatness level wafer processing, suppression of fine dust or particles, thereby to increase the yield of semiconductor devices, higher productivity due to simplification of processes, higher quality processing with lower manufacturing cost than conventional methods.
公开/授权文献
- US5167214A Push rod-actuated engine ignition apparatus 公开/授权日：1992-12-01
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