发明授权
- 专利标题: Polishing apparatus
- 专利标题(中): 抛光设备
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申请号: US795511申请日: 1997-02-05
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公开(公告)号: US5839947A公开(公告)日: 1998-11-24
- 发明人: Norio Kimura , Kunihiko Sakurai , Tetsuji Togawa , Seiji Katsuoka , Toyomi Nishi
- 申请人: Norio Kimura , Kunihiko Sakurai , Tetsuji Togawa , Seiji Katsuoka , Toyomi Nishi
- 申请人地址: JPX Tokyo
- 专利权人: Ebara Corporation
- 当前专利权人: Ebara Corporation
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX8-044199 19960205; JPX8-090569 19960319
- 主分类号: B24B53/007
- IPC分类号: B24B53/007 ; B24B53/017 ; B24B5/00 ; B24B29/00
摘要:
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, a top ring, for holding a workpiece to be polished and pressing the workpiece against the polishing surface, which is movable between a polishing position inside of the turntable and a standby position outside of the turntable, and a first device for keeping at least a lower surface of the top ring wet while the top ring is in the standby position. The polishing apparatus further includes a dressing tool for dressing the polishing surface on the turntable, and a second device for keeping at least a lower surface of the dressing tool wet while the dressing tool is in a standby position.
公开/授权文献
- USD342766S Toy sword 公开/授权日:1993-12-28