A ball grid array package in which one or more conductive rings are positioned on a surface of the package substrate along with solder bond contacts on the surface of the substrate to facilitate the interconnection of wire bonds to an integrated circuit chip on the surface of the substrate. The use of rings allows for better distribution of power to the chip since a plurality of wires can be connected between the chip and the conductive rings for power distribution. The rings create a different shelf for the power and ground bonds on the substrate, and by providing a vertical separation between the surfaces of the rings and bonding pads on the surface of the substrate more bonds in the package can be accommodated.