发明授权
US5844260A Compound semiconductor device constructed on a heteroepitaxial substrate
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在异质外延衬底上构造的复合半导体器件
- 专利标题: Compound semiconductor device constructed on a heteroepitaxial substrate
- 专利标题(中): 在异质外延衬底上构造的复合半导体器件
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申请号: US937785申请日: 1997-09-24
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公开(公告)号: US5844260A公开(公告)日: 1998-12-01
- 发明人: Tatsuya Ohori
- 申请人: Tatsuya Ohori
- 申请人地址: JPX Kanagawa
- 专利权人: Fujitsu Limited
- 当前专利权人: Fujitsu Limited
- 当前专利权人地址: JPX Kanagawa
- 优先权: JPX4-296587 19921009; JPX5-041797 19930208
- 主分类号: H01L21/20
- IPC分类号: H01L21/20 ; H01L21/205 ; H01L21/338 ; H01L29/778 ; H01L29/812 ; H01L31/0328 ; H01L31/0336 ; H01L31/072
摘要:
A compound semiconductor device constructed on a heteroepitaxial substrate includes a silicon substrate, a first compound semiconductor layer of a first compound semiconductor material provided on the silicon substrate as a buffer layer, a second compound semiconductor layer of a second compound semiconductor material having a lattice constant larger than that of the first compound semiconductor layer, and an active device provided on the second compound semiconductor layer, wherein the second compound semiconductor layer has a thickness exceeding a critical thickness above which dislocations develop due to the misfit in the lattice constant between the first and second compound semiconductor layers.