发明授权
- 专利标题: Microwave circuit package
- 专利标题(中): 微波电路封装
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申请号: US820817申请日: 1997-03-19
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公开(公告)号: US5847453A公开(公告)日: 1998-12-08
- 发明人: Hiroshi Uematsu , Hiroshi Kudoh , Masanobu Urabe
- 申请人: Hiroshi Uematsu , Hiroshi Kudoh , Masanobu Urabe
- 申请人地址: JPX Tokyo
- 专利权人: Honda Giken Kogyo Kabushiki Kaisha
- 当前专利权人: Honda Giken Kogyo Kabushiki Kaisha
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX8-072968 19960327; JPX8-109617 19960430
- 主分类号: H01L23/12
- IPC分类号: H01L23/12 ; H01L23/02 ; H01L23/045 ; H01L23/552 ; H01L23/66 ; H01L25/04 ; H01L25/18 ; H01P3/08 ; H01P5/08 ; H01L23/34 ; H01L29/40
摘要:
A microwave circuit package includes a metallic base plate on which are mounted a plurality of monolithic microwave integrated circuits (MMICs) and a spacer, made of a dielectric material, separating the MMICs from each other, and the MMICs and spacer are sealed in the package. The provision of the spacer substantially reduces the volume of the interior space of the package. A dielectric substrate having generally the same height as substrates of the MMICs may also be mounted on the metallic base plate, and a strip conductor may be provided on the dielectric substrate so as to form a microstrip line thereon.
公开/授权文献
- US5349018A Polyamide-hydrogenated polybutadiene-acrylonitrile copolymers 公开/授权日:1994-09-20