Invention Grant
- Patent Title: Plastic body surface-mounting semiconductor power device having dimensional characteristics optimized for use of standard shipping and testing modes
- Patent Title (中): 具有针对标准运输和测试模式优化的尺寸特性的塑料体表面贴装半导体功率器件
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Application No.: US788014Application Date: 1997-01-24
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Publication No.: US5852324APublication Date: 1998-12-22
- Inventor: Renato Poinelli , Mauro Mazzola
- Applicant: Renato Poinelli , Mauro Mazzola
- Applicant Address: ITX Agrate Brianza
- Assignee: SGS-Thomson Microelectronics S.r.l.
- Current Assignee: SGS-Thomson Microelectronics S.r.l.
- Current Assignee Address: ITX Agrate Brianza
- Priority: EPX96830030 19960125
- Main IPC: H01L23/50
- IPC: H01L23/50 ; H01L21/673 ; H01L23/31 ; H01L23/433 ; H05K1/02 ; H05K3/34
Abstract:
A QFP plastic surface-mounting semiconductor power device, comprising a plastic package inside which there is provided a chip which is connected by means of conductors to terminals that protrude from the plastic package, and a heat sink plate that is arranged on the bottom of the plastic package and has thinner ends, wherein the length of the heat sink plate is at least equal to the minimum length of the plastic package, channels being formed in the plastic package in a position that is adjacent to the thinner ends of the heat sink plate.
Public/Granted literature
- US4143510A Analogue electronic timepiece with setting means Public/Granted day:1979-03-13
Information query
IPC分类:
