发明授权
US5859155A Adhesive of epoxy resin, carboxylated rubber aromatic amine and
dicyandiamide
失效
环氧树脂，羧化橡胶芳香胺和双氰胺粘合剂
- 专利标题： Adhesive of epoxy resin, carboxylated rubber aromatic amine and dicyandiamide
- 专利标题（中）： 环氧树脂，羧化橡胶芳香胺和双氰胺粘合剂
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申请号： US858807申请日： 1997-05-19
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公开(公告)号： US5859155A公开(公告)日： 1999-01-12
- 发明人: Toshikazu Furihata , Akio Ikeda , Wataru Soejima
- 申请人： Toshikazu Furihata , Akio Ikeda , Wataru Soejima
- 申请人地址： JPX Tokyo
- 专利权人： Mitsui Chemicals, Inc.
- 当前专利权人： Mitsui Chemicals, Inc.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX6-109920 19940524
- 主分类号： C08G59/40
- IPC分类号： C08G59/40 ; C08G59/44 ; C08G59/50 ; C08G59/56 ; C08L63/00 ; C09J109/02 ; C09J163/00 ; H05K1/00 ; H05K1/03 ; H05K3/28 ; H05K3/38 ; C08K3/10 ; C08L13/00 ; C08L63/02
摘要：
There is provided an adhesive composition for use in a flexible printed circuit board, comprising:(a) an epoxy resin having substantially at least two epoxy groups per molecule;(b) at least one selected from carboxyl group-containing nitrile rubber and carboxyl group-containing hydrogenated nitrile rubber; and(c) a curing agent which comprises aromatic amine having substantially at least two primary amino groups per molecule (c1) and dicyandiamide (c2), the molar ratio of the aromatic amine (c1) to the dicyandiamide (c2) being 35/65.ltoreq.(c1)/(c2).ltoreq.99/1.
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