发明授权
- 专利标题： Method for chemically-mechanically polishing a metal layer
- 专利标题（中）： 化学机械抛光金属层的方法
-
申请号： US684782申请日： 1996-07-22
-
公开(公告)号： US5863838A公开(公告)日： 1999-01-26
- 发明人: Janos Farkas , Melissa Freeman
- 申请人： Janos Farkas , Melissa Freeman
- 申请人地址： IL Schaumburg
- 专利权人： Motorola, Inc.
- 当前专利权人： Motorola, Inc.
- 当前专利权人地址： IL Schaumburg
- 主分类号： B24B1/00
- IPC分类号： B24B1/00 ; C23F3/00 ; H01L21/304 ; H01L21/321 ; H01L21/60 ; C23F3/18 ; H05K3/26
摘要：
A method of manufacturing a semiconductor device includes providing (51) a substrate (19), providing (52) a colloid (17) having particles held in suspension, providing (53) a reagent (18), disposing (54) the substrate (19) in a processing tool (10), combining (55) the colloid (17) and the reagent (18) to form a slurry (28), decomposing (56) the reagent (18) into a surfactant and an oxidizer, using (57) the slurry (28) to process the substrate (19) in the processing tool (10), and removing (58) the substrate (19) from the processing tool (10).
公开/授权文献
- US5081194A No-post-cure method of curing polyacrylate polymers 公开/授权日：1992-01-14
信息查询
