发明授权
- 专利标题: Semiconductor integrated circuit device and manufacturing method for the same
- 专利标题(中): 半导体集成电路器件及其制造方法相同
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申请号: US974700申请日: 1997-11-19
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公开(公告)号: US5869872A公开(公告)日: 1999-02-09
- 发明人: Akiyoshi Asai , Jun Sakakibara , Megumi Suzuki , Seiji Fujino
- 申请人: Akiyoshi Asai , Jun Sakakibara , Megumi Suzuki , Seiji Fujino
- 申请人地址: JPX Kariya
- 专利权人: Nippondenso Co., Ltd.
- 当前专利权人: Nippondenso Co., Ltd.
- 当前专利权人地址: JPX Kariya
- 优先权: JPX7-173769 19950710; JPX8-039953 19960227
- 主分类号: H01L27/04
- IPC分类号: H01L27/04 ; H01L21/265 ; H01L21/822 ; H01L21/8238 ; H01L27/02 ; H01L27/06 ; H01L27/092 ; H01L27/12 ; H01L29/786 ; H01L23/62 ; H01L27/01 ; H01L27/76
摘要:
A semiconductor integrated circuit device having an SOI structure is capable of preventing occurrence of leak current flowing from a diffusion layer even when a semiconductor element having a pn-junction is included in the semiconductor substrate. The semiconductor integrated circuit device having the SOI structure is formed with a semiconductor layer, or SOI layer, on a p-type semiconductor substrate through a buried insulating film and further with semiconductor circuit elements serving as functional elements at the SOI layer thus formed. As a protection transistor to protect the semiconductor circuit elements, a MOSFET may be formed in which n-type diffusion layers are formed in the semiconductor substrate. The n-type diffusion layers of the MOSFET are to be surrounded by p-type diffusion layers more highly doped than the semiconductor substrate.