发明授权
- 专利标题: Packaged electronic module and integral sensor array
- 专利标题(中): 封装电子模块和积分传感器阵列
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申请号: US31019申请日: 1998-02-26
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公开(公告)号: US5869896A公开(公告)日: 1999-02-09
- 发明人: Robert Grover Baker , Claude Louis Bertin , Wayne John Howell , Joseph Michael Mosley
- 申请人: Robert Grover Baker , Claude Louis Bertin , Wayne John Howell , Joseph Michael Mosley
- 申请人地址: NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: NY Armonk
- 主分类号: H01L27/14
- IPC分类号: H01L27/14 ; G01J1/02 ; H01L21/60 ; H01L23/02 ; H01L25/065 ; H01L23/34
摘要:
An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization layer disposed on a side-surface of the stack. Specifically, wiring of the sensor assembly extends to an edge surface thereof corresponding to the side-surface of the stack where it electrically connects to the side-surface wiring. The IC chips of the stack are similarly electrically connected to the side-surface wiring. Multiple sensors (e.g., CCD arrays) may be electrically and mechanically coupled to multiple surfaces of the stack for providing a, e.g., multi-view imaging module. Multiple electrical and mechanical options exist for the connection of sensors to stacks within electronic modules.
公开/授权文献
- USD366614S Base for a bottle 公开/授权日:1996-01-30