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公开(公告)号：US5907178A
公开(公告)日：1999-05-25
申请号：US031028
申请日：1998-02-26
CPC分类号： H01L25/065 , H01L25/0652 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48465 , H01L2224/73265 , H01L2225/06551 , H01L2924/01077 , H01L2924/16152
摘要： An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization layer disposed on a side-surface of the stack. Specifically, wiring of the sensor assembly extends to an edge surface thereof corresponding to the side-surface of the stack where it electrically connects to the side-surface wiring. The IC chips of the stack are similarly electrically connected to the side-surface wiring. Multiple sensors (e.g., CCD arrays) may be electrically and mechanically coupled to multiple surfaces of the stack for providing a, e.g., multi-view imaging module. Multiple electrical and mechanical options exist for the connection of sensors to stacks within electronic modules.
摘要翻译： 电子模块包括多个堆叠的裸IC芯片（“堆叠”）和机械耦合到堆叠的端表面的传感器组件。 传感器组件和堆叠之间的电连接由设置在堆叠的侧表面上的金属化层提供。 具体地说，传感器组件的布线延伸到与其电连接到侧面布线的堆叠的侧表面相对应的边缘表面。 堆叠的IC芯片类似地电连接到侧面布线。 多个传感器（例如，CCD阵列）可以电和机械耦合到堆叠的多个表面以提供例如多视图成像模块。 存在多种电气和机械选项，用于将传感器连接到电子模块内的堆叠。
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公开(公告)号：US5763943A
公开(公告)日：1998-06-09
申请号：US592933
申请日：1996-01-29
CPC分类号： H01L25/065 , H01L25/0652 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48465 , H01L2224/73265 , H01L2225/06551 , H01L2924/01077 , H01L2924/16152
摘要： An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization layer disposed on a side-surface of the stack. Specifically, wiring of the sensor assembly extends to an edge surface thereof corresponding to the side-surface of the stack where it electrically connects to the side-surface wiring. The IC chips of the stack are similarly electrically connected to the side-surface wiring. Multiple sensors (e.g., CCD arrays) may be electrically and mechanically coupled to multiple surfaces of the stack for providing a, e.g., multi-view imaging module. Multiple electrical and mechanical options exist for the connection of sensors to stacks within electronic modules.
摘要翻译： 电子模块包括多个堆叠的裸IC芯片（“堆叠”）和机械耦合到堆叠的端表面的传感器组件。 传感器组件和堆叠之间的电连接由设置在堆叠的侧表面上的金属化层提供。 具体地说，传感器组件的布线延伸到与其电连接到侧面布线的堆叠的侧表面相对应的边缘表面。 堆叠的IC芯片类似地电连接到侧面布线。 多个传感器（例如，CCD阵列）可以电和机械耦合到堆叠的多个表面以提供例如多视图成像模块。 存在多种电气和机械选项，用于将传感器连接到电子模块内的堆叠。
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公开(公告)号：US5734130A
公开(公告)日：1998-03-31
申请号：US511180
申请日：1995-08-04
申请人： Robert Grover Baker
发明人： Robert Grover Baker
CPC分类号： G06F3/041
摘要： Digitizing apparatus comprises an array of Hall effect elements. The array includes conditioning circuitry and scanning circuitry for sensing the conditions of all Hall effect elements and determining which elements have been actuated by a user manipulated magnetic actuator. The apparatus inputs digital signals into a computer, the signals indicating relative positions of actuated Hall effect elements.
摘要翻译： 数字化装置包括霍尔效应元件阵列。 该阵列包括用于感测所有霍尔效应元件的条件的调节电路和扫描电路，并且确定哪些元件已由用户操纵的磁性致动器致动。 该装置将数字信号输入到计算机中，该信号指示致动霍尔效应元件的相对位置。
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公开(公告)号：US5869896A
公开(公告)日：1999-02-09
申请号：US31019
申请日：1998-02-26
CPC分类号： H01L25/065 , H01L25/0652 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48465 , H01L2224/73265 , H01L2225/06551 , H01L2924/01077 , H01L2924/16152
摘要： An electronic module includes multiple stacked bare IC chips ("a stack") and a sensor assembly that is mechanically coupled to an end surface of the stack. Electrical connection between the sensor assembly and the stack is provided by a metallization layer disposed on a side-surface of the stack. Specifically, wiring of the sensor assembly extends to an edge surface thereof corresponding to the side-surface of the stack where it electrically connects to the side-surface wiring. The IC chips of the stack are similarly electrically connected to the side-surface wiring. Multiple sensors (e.g., CCD arrays) may be electrically and mechanically coupled to multiple surfaces of the stack for providing a, e.g., multi-view imaging module. Multiple electrical and mechanical options exist for the connection of sensors to stacks within electronic modules.
摘要翻译： 电子模块包括多个堆叠的裸IC芯片（“堆叠”）和机械耦合到堆叠的端表面的传感器组件。 传感器组件和堆叠之间的电连接由设置在堆叠的侧表面上的金属化层提供。 具体地说，传感器组件的布线延伸到与其电连接到侧面布线的堆叠的侧表面相对应的边缘表面。 堆叠的IC芯片类似地电连接到侧面布线。 多个传感器（例如，CCD阵列）可以电和机械耦合到堆叠的多个表面以提供例如多视图成像模块。 存在多种电气和机械选项，用于将传感器连接到电子模块内的堆叠。
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公开(公告)号：US5675751A
公开(公告)日：1997-10-07
申请号：US558379
申请日：1995-11-16
申请人： Robert Grover Baker , Duy Quoc Huynh , Dennis Lee Moeller , Paul Richard Swingle , Loc Tien Tran , Suksoon Yong
发明人： Robert Grover Baker , Duy Quoc Huynh , Dennis Lee Moeller , Paul Richard Swingle , Loc Tien Tran , Suksoon Yong
IPC分类号： G06F13/364 , G06F13/40 , G06F13/14
CPC分类号： G06F13/4027 , G06F13/364 , G06F13/4031
摘要： A computer system having a peripheral bus and a digital signal processor (DSP) local bus interfacing to the peripheral bus via an extended bus interface circuit (EBIC). The DSP local bus is configured such that devices, which are typically two or more DSPs, electrically connected to the DSP local bus may transfer data to other devices connected to the DSP local bus regardless of data transfer activity of the peripheral bus. Moreover, as seen from the peripheral bus, the devices connected to the DSP local bus have the same arbitration level. However, as seen from the DSP local bus, each device connected to the DSP local bus has a unique arbitration level determined by the priority of the tasks executing on the respective devices, as determined by a DSP operating system.
摘要翻译： 具有外围总线和数字信号处理器（DSP）本地总线的计算机系统，其经由扩展总线接口电路（EBIC）与外围总线接口。 DSP本地总线被配置为使得电连接到DSP本地总线的通常为两个或更多个DSP的设备可以将数据传送到连接到DSP本地总线的其他设备，而不管外围总线的数据传输活动如何。 此外，从外围总线看，连接到DSP本地总线的设备具有相同的仲裁级别。 然而，从DSP本地总线可以看出，连接到DSP本地总线的每个设备具有由DSP操作系统确定的由各个设备执行的任务的优先级确定的唯一仲裁级别。
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