发明授权
US5871610A Apparatus for automatically mounting a plurality of semiconductor chips
on a lead frame
失效
用于将引导框架上的多个半导体芯片自动安装的装置
- 专利标题： Apparatus for automatically mounting a plurality of semiconductor chips on a lead frame
- 专利标题（中）： 用于将引导框架上的多个半导体芯片自动安装的装置
-
申请号： US24913申请日： 1993-03-02
-
公开(公告)号： US5871610A公开(公告)日： 1999-02-16
- 发明人: Tomio Minohoshi , Toyohiko Takeda , Hideo Numata
- 申请人： Tomio Minohoshi , Toyohiko Takeda , Hideo Numata
- 申请人地址： JPX Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX2-189485 19900719
- 主分类号： H01L21/52
- IPC分类号： H01L21/52 ; H01L21/00 ; B32B31/00
摘要：
Lead frames supplied from a first supply unit are intermittently conveyed in a non-oxidizing atmosphere. An adhesive is supplied from a second supply unit onto islands of the lead frames, and also semiconductor chips are supplied from a third supply unit onto the islands. When one of different kinds of semiconductor chips supplied from the third supply unit is selected, the selected semiconductor chip is held by a holder having a configuration adapted to the selected semiconductor chip. Therefore, transfer means for semiconductor chips includes at least two kinds of holders.