发明授权
US5880220A Biodegradable polymers, process for the preparation thereof and the use
thereof for producing biodegradable moldings
失效
生物可降解聚合物,其制备方法及其生产可生物降解成型品的用途
- 专利标题: Biodegradable polymers, process for the preparation thereof and the use thereof for producing biodegradable moldings
- 专利标题(中): 生物可降解聚合物,其制备方法及其生产可生物降解成型品的用途
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申请号: US860027申请日: 1997-07-03
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公开(公告)号: US5880220A公开(公告)日: 1999-03-09
- 发明人: Volker Warzelhan , Gunnar Schornick , Frank Braun , Ursula Seeliger , Motonori Yamamoto , Peter Bauer
- 申请人: Volker Warzelhan , Gunnar Schornick , Frank Braun , Ursula Seeliger , Motonori Yamamoto , Peter Bauer
- 申请人地址: DEX Ludwigshafen
- 专利权人: BASF Aktiengesellschaft
- 当前专利权人: BASF Aktiengesellschaft
- 当前专利权人地址: DEX Ludwigshafen
- 优先权: DEX19500755.7 19950113
- 主分类号: C08G69/40
- IPC分类号: C08G69/40 ; C08G18/60 ; C08G69/44 ; C08G69/48 ; C08G73/00 ; C08G73/04 ; C08J9/04 ; C08K5/353 ; C08L77/12 ; C08L101/16 ; C09J177/12 ; D21H19/30
摘要:
Biodegradable polyetheresteramides P1 which are obtained by reacting(a1) a mixture containing20-95 mol % of adipic acid or ester-forming derivatives thereof or mixtures thereof and5-80 mol % of terephthalic acid or ester-forming derivatives thereof or mixtures thereof, and(a2) a mixture of dihydroxy compounds(a21) from 15 to 99.3 mol % of a dihydroxy compound selected from the group consisting of C.sub.2 -C.sub.6 -alkanediols and C.sub.5 -C.sub.10 -cycloalkanediols,(a22) from 0.2 to 85 mol % of a dihydroxy compound containing ether functionalities of the formula IHO--((CH.sub.2).sub.n --O).sub.m --H I where n is 2, 3 or 4 and m is an integer from 2 to 250, or mixtures thereof and(a23) from 0.5 to 80 mol % of an amino-C.sub.2 -C.sub.12 -alkanol or amino-C.sub.5 -C.sub.10 -cycloalkanol,where the molar ratio of (a1) to (a2) is from 0.4:1 to 1.5:1, with the proviso, inter alia, that the polyetheresteramides P1 have a molecular weight (M.sub.n) in the range from 5000 to 80,000 g/mol, and biodegradable polymers, biodegradable moldings, and adhesives obtained from the disclosed polymers.
公开/授权文献
- US5284361A Modular book kit and method of assembly 公开/授权日:1994-02-08
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