发明授权
- 专利标题： Ultrahigh-frequency electronic component
- 专利标题（中）： 超高频电子元件
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申请号： US855537申请日： 1997-05-13
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公开(公告)号： US5889232A公开(公告)日： 1999-03-30
- 发明人: Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka , Kenji Uchida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
- 申请人： Seiji Ichikawa , Tomoaki Hirokawa , Tomoaki Kimura , Taku Sato , Junichi Tanaka , Kenji Uchida , Masatoshi Ohara , Takeo Ogihara , Satoshi Murata , Tsutomu Kubota
- 申请人地址： JPX Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX8-118831 19960514
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/29 ; H01L23/31 ; H01L23/28
摘要：
An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.
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