公开(公告)号：US5970322A

公开(公告)日：1999-10-19

申请号：US4447

申请日：1998-01-08

申请人： Seiji Ichikawa ,  Tomoaki Hirokawa ,  Tomoaki Kimura ,  Taku Sato ,  Junichi Tanaka ,  Kenji Uchida ,  Masatoshi Ohara ,  Takeo Ogihara ,  Satoshi Murata ,  Tsutomu Kubota

发明人： Seiji Ichikawa ,  Tomoaki Hirokawa ,  Tomoaki Kimura ,  Taku Sato ,  Junichi Tanaka ,  Kenji Uchida ,  Masatoshi Ohara ,  Takeo Ogihara ,  Satoshi Murata ,  Tsutomu Kubota

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/565 ,  H01L23/295 ,  H01L23/3135 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181

摘要： An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.

摘要翻译： 超高频电子元件具有封装在模制树脂封装中的超高频芯片。 超高频电子部件包括在其中包围超高频芯片的第一密封层和在其中包封第一密封层的第二密封层。 第一密封层包含多个空隙或微小的气泡，其有效降低第一密封层的介电常数。 还公开了一种制造超高频电子部件的方法。

公开(公告)号：US5904501A

公开(公告)日：1999-05-18

申请号：US824459

申请日：1997-03-26

申请人： Masatoshi Ohara ,  Takeo Ogihara ,  Satoshi Murata ,  Kenji Uchida ,  Tsutomu Kubota ,  Seiji Ichikawa ,  Tomoaki Hirokawa ,  Tomoaki Kimura ,  Taku Sato ,  Junichi Tanaka

发明人： Masatoshi Ohara ,  Takeo Ogihara ,  Satoshi Murata ,  Kenji Uchida ,  Tsutomu Kubota ,  Seiji Ichikawa ,  Tomoaki Hirokawa ,  Tomoaki Kimura ,  Taku Sato ,  Junichi Tanaka

IPC分类号： H01L23/02 ,  H01L21/00 ,  H01L23/04 ,  H01L23/10 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/67126 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S257/924

摘要： A hollow package manufacturing method includes the adhesive spreading step, the adhesive applying step, and the cap adhering step. In the adhesive spreading step, an adhesive is spread on a circular table to a uniform thickness. In the adhesive applying step, an open end face of a cylindrical cap having a bottom is urged against the circular table to apply the adhesive to the cap. In the cap adhering step, the cap applied with the adhesive is adhered to a case. A hollow package manufacturing apparatus is also disclosed.

摘要翻译： 中空包装制造方法包括粘合剂铺展步骤，粘合剂施加步骤和盖子粘合步骤。 在粘合剂铺展步骤中，将粘合剂铺展在圆桌上以均匀的厚度。 在粘合剂涂布步骤中，具有底部的圆筒形盖的开口端面被推靠在圆台上以将粘合剂施加到盖上。 在盖接合步骤中，将涂有粘合剂的盖子粘附到壳体上。 还公开了一种中空包装制造装置。

公开(公告)号：US5889232A

公开(公告)日：1999-03-30

申请号：US855537

申请日：1997-05-13

申请人： Seiji Ichikawa ,  Tomoaki Hirokawa ,  Tomoaki Kimura ,  Taku Sato ,  Junichi Tanaka ,  Kenji Uchida ,  Masatoshi Ohara ,  Takeo Ogihara ,  Satoshi Murata ,  Tsutomu Kubota

发明人： Seiji Ichikawa ,  Tomoaki Hirokawa ,  Tomoaki Kimura ,  Taku Sato ,  Junichi Tanaka ,  Kenji Uchida ,  Masatoshi Ohara ,  Takeo Ogihara ,  Satoshi Murata ,  Tsutomu Kubota

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/28

CPC分类号： H01L21/565 ,  H01L23/295 ,  H01L23/3135 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181

摘要： An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.

摘要翻译： 超高频电子元件具有封装在模制树脂封装中的超高频芯片。 超高频电子部件包括在其中包围超高频芯片的第一密封层和在其中包封第一密封层的第二密封层。 第一密封层包含多个空隙或微小的气泡，其有效降低第一密封层的介电常数。 还公开了一种制造超高频电子部件的方法。

公开(公告)号：US6011303A

公开(公告)日：2000-01-04

申请号：US978648

申请日：1997-11-26

申请人： Junichi Tanaka ,  Seiji Ichikawa ,  Tomoaki Hirokawa ,  Tomoaki Kimura ,  Taku Sato ,  Kenji Watanabe ,  Kenji Utida ,  Masatoshi Ohara ,  Takeo Ogihara ,  Satoshi Murata ,  Tsutomu Kubota

发明人： Junichi Tanaka ,  Seiji Ichikawa ,  Tomoaki Hirokawa ,  Tomoaki Kimura ,  Taku Sato ,  Kenji Watanabe ,  Kenji Utida ,  Masatoshi Ohara ,  Takeo Ogihara ,  Satoshi Murata ,  Tsutomu Kubota

IPC分类号： H01L23/48 ,  H01L23/02 ,  H01L23/04 ,  H01L23/31 ,  H01L23/50 ,  H01L23/66

CPC分类号： H01L23/315 ,  H01L23/66 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/30107

摘要： An electronic component includes a substrate portion, a bank portion, a plurality of lead members, an anchor hole, and at least a pair of notches. A chip is supported on the substrate portion. The bank portion is formed on a periphery of the substrate portion to surround the chip. The plurality of lead members are made of conductive strip pieces, and each lead member has an inner lead electrically connected to the chip and an outer lead extending to an outside. The substrate portion and the bank portion are integrally molded with a resin to include the lead members, so that the inner and outer leads are fixed to a connecting portion between the substrate portion and the bank portion. The anchor hole is formed in a portion where each of the lead members is in contact with the bank portion, and is filled with a resin. The pair of notches are formed in two ends of each of the lead members to sandwich the anchor hole.

摘要翻译： 电子部件包括基板部分，堤部分，多个引线部件，锚定孔以及至少一对凹口。 芯片支撑在基板部分上。 堤部分形成在基片部分的周围以围绕芯片。 多个引线构件由导电条片制成，并且每个引线构件具有电连接到芯片的内引线和延伸到外部的外引线。 基板部分和堤部分用树脂一体地模制成包括引线部件，使得内引线和外引线固定到基片部分和堤部之间的连接部分。 锚定孔形成在每个引导部件与堤部分接触的部分中，并且填充有树脂。 一对切口形成在每个引导构件的两端以夹持锚定孔。