发明授权
- 专利标题： Heating and cooling apparatus for reaction chamber
- 专利标题（中）： 反应室加热冷却装置
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申请号： US758246申请日： 1996-11-27
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公开(公告)号： US5892207A公开(公告)日： 1999-04-06
- 发明人: Hideki Kawamura , Hirochika Yamamoto , Yukinobu Nishikawa
- 申请人： Hideki Kawamura , Hirochika Yamamoto , Yukinobu Nishikawa
- 申请人地址： JPX Tokyo
- 专利权人： Teisan Kabushiki Kaisha
- 当前专利权人： Teisan Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX7-335657 19951201
- 主分类号： C23C14/54
- IPC分类号： C23C14/54 ; C23C16/46 ; G05D23/19 ; H01L21/00 ; H01L21/203 ; H01L21/302 ; H01L21/3065 ; H01L21/683 ; B23K10/00
摘要：
The present invention relates to a temperature regulation apparatus capable of easily regulating the temperature of a support for a substance to be treated, such as a semiconductor wafer.The temperature regulation apparatus includes a liquid nitrogen supply device for supplying liquid nitrogen into a temperature regulation space provided in the inside of a support so as to effect flashing of the liquid nitrogen. A heating device for heating the support and temperature sensors for detecting the temperature of the support are also provided. A temperature setting device sets the temperature of the support at a desired temperature and a controller controls the liquid nitrogen supply device and the heating device based on a temperature detected by the temperature sensors, so that the support reaches and is maintained at the set temperature.
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