发明授权
- 专利标题： Package and semiconductor device
- 专利标题（中）： 封装和半导体器件
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申请号： US62752申请日： 1998-04-20
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公开(公告)号： US5901042A公开(公告)日： 1999-05-04
- 发明人: Yorito Ota , Masahiro Maeda , Shigeru Morimoto , Morio Nakamura
- 申请人： Yorito Ota , Masahiro Maeda , Shigeru Morimoto , Morio Nakamura
- 申请人地址： JPX Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JPX Osaka
- 优先权： JPX9-103450 19970421
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/36 ; H01L23/66 ; H01L25/16 ; H05K7/20
摘要：
A semiconductor chip is mounted on the central portion of a metal heat radiator. A pair of metal projecting members are provided on the heat radiator externally of the pair of opposed sides of the semiconductor chip to extend therealong beyond both ends of the semiconductor chip. A circuit board is mounted on the side of each of the pair of projecting members opposed to the semiconductor chip. The top surface of the semiconductor chip and the top surface of each of the projecting members are connected to each other by a third bonding wire for grounding.
公开/授权文献
- USD398381S Bathtub 公开/授权日：1998-09-15
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