公开(公告)号：US07948088B2

公开(公告)日：2011-05-24

申请号：US12063606

申请日：2006-08-25

申请人： Toshio Saito ,  Satoshi Moriya ,  Morio Nakamura ,  Goichi Yokoyama ,  Tatsuyuki Saito ,  Nobuaki Miyakawa

发明人： Toshio Saito ,  Satoshi Moriya ,  Morio Nakamura ,  Goichi Yokoyama ,  Tatsuyuki Saito ,  Nobuaki Miyakawa

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L21/763 ,  H01L21/76898 ,  H01L21/823871 ,  H01L21/823878 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/45 ,  H01L24/48 ,  H01L25/50 ,  H01L27/0203 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： In order to improve the manufacturing yield of a semiconductor device having a three-dimensional structure in which a plurality of chips are stacked and attached to each other, the opening shape of each of conductive grooves (4A) formed in each chip (C2) obtained from a wafer (W2) is rectangular, and the number of the conductive grooves (4A) whose long-sides are directed in a Y direction and the number of the conductive grooves (4A) whose long-sides are directed in an X direction perpendicular to the Y direction are made to be approximately equal to each other number in the entire wafer (W2), whereby the film stress upon embedding of a conductive film into the interior of the conductive grooves is reduced, and generation of exfoliation and micro-cracks in the conductive film or warpage and cracks of the wafer (W2) are prevented.

摘要翻译： 为了提高具有多个芯片彼此堆叠并附接的三维结构的半导体器件的制造成品，形成在每个芯片（C2）中的每个导电槽（4A）的开口形状获得 从晶片（W2）的长方形的长方形的导体槽（4A）的长度方向的长度方向的数量和长边方向的X方向的导体槽的数量 使整个晶片（W2）的Y方向大致相等，由此导电膜嵌入导电槽内的膜应力减小，剥离和微裂纹的产生 导致膜或翘曲和晶片（W2）的裂纹被阻止。

公开(公告)号：US5180798A

公开(公告)日：1993-01-19

申请号：US637155

申请日：1991-01-03

申请人： Morio Nakamura ,  Takushi Yamamoto ,  Hitoshi Tanaka ,  Hitoshi Ozawa ,  Yasuhiro Shimada

发明人： Morio Nakamura ,  Takushi Yamamoto ,  Hitoshi Tanaka ,  Hitoshi Ozawa ,  Yasuhiro Shimada

IPC分类号： A61L15/60 ,  C08F2/20 ,  C08F2/32 ,  C08F20/00 ,  C08F20/06 ,  C08F20/56 ,  C08F120/04

CPC分类号： C08F2/32 ,  A61L15/60

摘要： An improved process for the production of a water-absorbent resin by reversed phase suspension polymerization of a water-soluble ethylenic unsaturated monomer is disclosed. The process is conducted by subjecting an aqueous solution of a water-soluble ethylenic unsaturated monomer to reversed phase suspension polymerization reaction of a first stage in a petroleum hydrocarbon solvent in the presence of a surfactant and/or polymeric protective colloid by using a radical polymerization initiator optionally in the presence of a crosslinking agent, cooling the resulting slurry to precipitate the surfactant and/or polymeric protective colloid, and adding an aqueous solution of a water-soluble ethylenic unsaturated monomer containing a radical polymerization initiator and optionally a crosslinking agent to the first polymerization reaction system to further carry out the reversed phase suspension polymerization reaction, at least, once.

公开(公告)号：US06573330B1

公开(公告)日：2003-06-03

申请号：US09208422

申请日：1998-12-10

申请人： Masato Fujikake ,  Yasuhiro Nawata ,  Magoto Shirakawa ,  Masakazu Yamamori ,  Shioko Yoshinaka ,  Morio Nakamura

发明人： Masato Fujikake ,  Yasuhiro Nawata ,  Magoto Shirakawa ,  Masakazu Yamamori ,  Shioko Yoshinaka ,  Morio Nakamura

IPC分类号： C08F26502

CPC分类号： C08F291/00 ,  C08F265/02 ,  C08F2/16

摘要： A process for preparing a water-absorbent resin is provided which enables the water-absorbent resin to ensure the reduction in the release amount of liquid and the increase in the liquid diffusibility. In the preparation process, the water-absorbent resin is prepared by polymerization of a water-soluble ethylenic unsaturated monomer. The polymerization of the water-soluble ethylenic unsaturated monomer is allowed to take place in the presence of a water-absorbent resin having a water-absorbing rate different from that of a water-absorbent resin resulting from polymerization of the water-soluble ethylenic unsaturated monomer. In a preferred mode, the polymerization is performed by a reversed-phase suspension polymerization method.

摘要翻译： 提供了一种制备吸水性树脂的方法，其使得吸水性树脂能够确保液体的释放量的降低和液体扩散性的增加。 在制备方法中，吸水性树脂通过水溶性烯键式不饱和单体的聚合制备。 使水溶性烯属不饱和单体的聚合在吸水性树脂的存在下进行，该吸水性树脂的吸水速度与由水溶性烯属不饱和单体聚合引起的吸水性树脂的吸水速度不同 。 在优选的方式中，通过反相悬浮聚合法进行聚合。

公开(公告)号：US6166436A

公开(公告)日：2000-12-26

申请号：US60600

申请日：1998-04-15

申请人： Masahiro Maeda ,  Morio Nakamura ,  Takayuki Yoshida ,  Masazumi Yamazaki

发明人： Masahiro Maeda ,  Morio Nakamura ,  Takayuki Yoshida ,  Masazumi Yamazaki

IPC分类号： H01L21/56 ,  H01L23/482 ,  H01L23/66 ,  H01L21/44 ,  H01L21/60

CPC分类号： H01L23/4824 ,  H01L21/563 ,  H01L23/66 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10329 ,  H01L2924/1306 ,  H01L2924/13064 ,  H01L2924/1423 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/01015 ,  H01L2924/01031 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

摘要： A high frequency semiconductor device includes: a substrate having a substantially flat principal surface, with a predetermined circuit pattern including at least an input line, an output line, and a ground electrode provided on the principal surface; and a transistor which has a drain electrode, a source electrode, and a gate electrode and is mounted on the substrate by a flip chip mounting. The source electrode and the ground electrode are connected to each other by a first bump in the flip chip mounting.

摘要翻译： 高频半导体器件包括：具有基本上平坦的主表面的基板，具有至少包括设置在主表面上的输入线，输出线和接地电极的预定电路图案; 以及具有漏电极，源电极和栅电极并通过倒装芯片安装而安装在基板上的晶体管。 源电极和接地电极通过倒装芯片安装中的第一凸块相互连接。

公开(公告)号：US5901042A

公开(公告)日：1999-05-04

申请号：US62752

申请日：1998-04-20

申请人： Yorito Ota ,  Masahiro Maeda ,  Shigeru Morimoto ,  Morio Nakamura

发明人： Yorito Ota ,  Masahiro Maeda ,  Shigeru Morimoto ,  Morio Nakamura

IPC分类号： H01L23/12 ,  H01L23/36 ,  H01L23/66 ,  H01L25/16 ,  H05K7/20

CPC分类号： H01L25/165 ,  H01L23/36 ,  H01L23/66 ,  H01L24/49 ,  H01L25/162 ,  H01L2223/6644 ,  H01L2224/48091 ,  H01L2224/48237 ,  H01L2224/49175 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/13063 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3011 ,  H01L2924/30111

摘要： A semiconductor chip is mounted on the central portion of a metal heat radiator. A pair of metal projecting members are provided on the heat radiator externally of the pair of opposed sides of the semiconductor chip to extend therealong beyond both ends of the semiconductor chip. A circuit board is mounted on the side of each of the pair of projecting members opposed to the semiconductor chip. The top surface of the semiconductor chip and the top surface of each of the projecting members are connected to each other by a third bonding wire for grounding.

摘要翻译： 半导体芯片安装在金属散热器的中心部分上。 一对金属突出构件设置在半导体芯片的一对相对侧的外部的散热器上，以延伸超过半导体芯片的两端。 电路板安装在与半导体芯片相对的一对突出构件中的每一个的侧面上。 半导体芯片的顶表面和每个突出构件的顶表面通过用于接地的第三接合线彼此连接。

公开(公告)号：US5838543A

公开(公告)日：1998-11-17

申请号：US812484

申请日：1997-03-06

申请人： Morio Nakamura ,  Masahiro Maeda

发明人： Morio Nakamura ,  Masahiro Maeda

IPC分类号： H01L23/367 ,  H05K7/20 ,  H05K9/00

CPC分类号： H05K9/0056 ,  H01L23/3677 ,  H01L23/66 ,  H05K7/20445 ,  H01L2924/0002

摘要： A radio frequency power amplification module includes: a radiation section; a printed circuit board attached to the radiation section; a semiconductor device for power amplification, mounted on the printed circuit board; and a cap. The radiation section includes a plurality of radiation boards, the plurality of radiation boards at least including a first radiation board as a lowermost layer, and a second radiation board attached onto the first radiation board, the first radiation board being coupled to the cap.

摘要翻译： 射频功率放大模块包括：辐射部分; 连接到辐射部分的印刷电路板; 用于功率放大的半导体器件，安装在印刷电路板上; 和帽子。 所述辐射部分包括多个辐射板，所述多个辐射板至少包括作为最下层的第一辐射板，以及连接到所述第一辐射板上的第二辐射板，所述第一辐射板耦合到所述盖。

公开(公告)号：US5326852A

公开(公告)日：1994-07-05

申请号：US907039

申请日：1992-07-01

申请人： Masato Fujikake ,  Morio Nakamura ,  Shinji Kobayashi ,  Katsunori Tanaka ,  Masahiro Suzuki

发明人： Masato Fujikake ,  Morio Nakamura ,  Shinji Kobayashi ,  Katsunori Tanaka ,  Masahiro Suzuki

IPC分类号： C08G65/02 ,  C08G65/12

CPC分类号： B01J31/0212 ,  C08G65/12 ,  B01J2231/48 ,  Y10S502/513

摘要： The present invention is directed to a method for production of alkylene oxide polymers comprising reacting an alkylene oxide in an inert hydrocarbon solvent in the presence of a catalyst. The method of the present invention offers alkylene oxide polymers with a great commercial value and a high degree of polymerization which can be produced industrially advantageously with high reproducibility by the use of a catalyst obtained by a simple procedure of applying heat treatment to the product obtained by reacting an organic zinc compound with particular aliphatic polyhydric alcohol and monohydric alcohol.

摘要翻译： 本发明涉及一种生产烯化氧聚合物的方法，其包括在惰性烃溶剂中在催化剂存在下使烯化氧反应。 本发明的方法提供了具有很大商业价值和高聚合度的环氧烷聚合物，其可以通过使用通过简单的方法对通过以下方法得到的产物进行热处理而获得的催化剂在工业上有利地以高重现性有效地制备： 使有机锌化合物与特定的脂族多元醇和一元醇反应。

公开(公告)号：US4880888A

公开(公告)日：1989-11-14

申请号：US238

申请日：1987-01-05

申请人： Shigeji Obayashi ,  Morio Nakamura ,  Takushi Yamamoto ,  Hitoshi Tanaka ,  Yuji Sakamoto

发明人： Shigeji Obayashi ,  Morio Nakamura ,  Takushi Yamamoto ,  Hitoshi Tanaka ,  Yuji Sakamoto

IPC分类号： C10L1/04 ,  C08F2/00 ,  C08F20/04 ,  C10L1/16 ,  F02B1/04

CPC分类号： C08F20/04 ,  F02B1/04

摘要： A water-absorbent resin having excellent physical properties can be produced by a process wherein an aqueous solution containing an .alpha.,.beta.-unsaturated carboxylic acid and an alkali metal salt thereof in a total amount of 25% by weight or more is subjected to polymerization with a radical polymerization initiator in a petroleum-based hydrocarbon solvent in the presence or absence of a crosslinking agent, characterized by using, as a surfactant, a polyglycerine--fatty acid ester having an HLB of 2 to 16 and represented by the general formula ##STR1## (wherein R is an acyl group or hydrogen atom and n is an integer of 0 to 8).

摘要翻译： 具有优异物理性质的吸水性树脂可以通过以下方法制备，其中将含有总量为25重量％以上的α，β-不饱和羧酸及其碱金属盐的水溶液与 在存在或不存在交联剂的情况下，在石油基烃溶剂中的自由基聚合引发剂，其特征在于使用HLB为2〜16的聚甘油 - 脂肪酸酯作为表面活性剂，由通式（其中R是酰基或氢原子，n是0至8的整数）。

公开(公告)号：US4590227A

公开(公告)日：1986-05-20

申请号：US664175

申请日：1984-10-24

申请人： Morio Nakamura ,  Shigeji Obayashi ,  Shinichi Takemori ,  Hitoshi Tanaka ,  Motomu Hirakawa

发明人： Morio Nakamura ,  Shigeji Obayashi ,  Shinichi Takemori ,  Hitoshi Tanaka ,  Motomu Hirakawa

IPC分类号： A61L15/22 ,  A61L15/60 ,  C08L21/00 ,  C08L51/02 ,  C08L1/26 ,  C08L3/04 ,  C08L7/00 ,  C08L9/00

CPC分类号： C08L21/00 ,  A61L15/225 ,  A61L15/60 ,  C08L51/02

摘要： Water-swellable elastomer composition consisting essentially of a homogeneous mixture of an elastomer, a water-absorbent resin and a water-soluble resin. Said composition exhibits a high degree of swelling and a high swelling rate when it is soaked in water. Also, said composition retains swellability even when it is put in contact with water for a long period of time.

摘要翻译： 基本上由弹性体，吸水性树脂和水溶性树脂的均匀混合物组成的水溶胀性弹性体组合物。 当在水中浸泡时，所述组合物表现出高度的膨胀和高膨胀率。 而且，即使长时间与水接触，所述组合物保持溶胀性。

公开(公告)号：US4507438A

公开(公告)日：1985-03-26

申请号：US448150

申请日：1982-12-09

申请人： Shigeji Obayashi ,  Morio Nakamura ,  Takushi Yamamoto ,  Masato Fujikake

发明人： Shigeji Obayashi ,  Morio Nakamura ,  Takushi Yamamoto ,  Masato Fujikake

IPC分类号： C08J3/24 ,  A61L15/60 ,  B01J20/26 ,  C08F20/06 ,  C08L33/02 ,  C08L63/00 ,  C08L3/02 ,  C08L9/00 ,  C08L31/04 ,  C08L33/06

CPC分类号： C08L33/02 ,  A61L15/60 ,  C08L63/00

摘要： Water-absorbent resins having improved water-absorbency, water-absorption rate and water-dispersibility can be produced by crosslinking a water-absorbent resin comprising a carboxylate as a constituent of the resin with a crosslinking agent having at least two functional groups in the presence of water in a proportion of 0.01 to 1.3 parts by weight per part by weight of the resin in an inert solvent.

摘要翻译： 具有改善的吸水性，吸水率和水分散性的吸水性树脂可以通过在存在下具有至少两个官能团的交联剂交联包含作为树脂成分的羧酸盐的吸水性树脂来制备 的水，其比例为在惰性溶剂中每重量份树脂0.01至1.3重量份。