发明授权
- 专利标题： Structure for semiconductor package for improving the efficiency of spreading heat
- 专利标题（中）： 用于提高散热效率的半导体封装结构
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申请号： US75879申请日： 1998-05-12
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公开(公告)号： US5903052A公开(公告)日： 1999-05-11
- 发明人: Lung-Tai Chen , Ping-Huang Chiang , Yu-Kon Chou , Chien-Chi Chao
- 申请人： Lung-Tai Chen , Ping-Huang Chiang , Yu-Kon Chou , Chien-Chi Chao
- 申请人地址： TWX Hsinchu Hsien
- 专利权人： Industrial Technology Research Institute
- 当前专利权人： Industrial Technology Research Institute
- 当前专利权人地址： TWX Hsinchu Hsien
- 主分类号： H01L23/24
- IPC分类号： H01L23/24 ; H01L23/367 ; H01L23/498 ; H05K3/34 ; H01L23/495 ; H01L23/12
摘要：
The present invention includes a substrate having a first opening. A heat spreader is attached on the bottom surface of the substrate. The bottom side surface of the heat spreader has trench pattern. The trench pattern includes a plurality of connecting cavities and a plurality of trenches. The chip is mounted on the top side surface of the heat spreader. A supporting member is formed on the top side surface of the substrate. The space among the substrate, the chip, the heat spreader and the supporting member is encapsulated by encapsulating material. The preformed solder balls are mounted on the bottom side surface of the substrate.
公开/授权文献
- USD408609S Grab 公开/授权日：1999-04-20
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