- 专利标题： Minimal capture pads applied to ceramic vias in ceramic substrates
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申请号： US450113申请日： 1995-05-25
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公开(公告)号： US5916451A公开(公告)日： 1999-06-29
- 发明人: Eric Daniel Perfecto , Chandrika Prasad , Keshav Prasad , Gordon Jay Robbins , Madhavan Swaminathan , George Eugene White
- 申请人： Eric Daniel Perfecto , Chandrika Prasad , Keshav Prasad , Gordon Jay Robbins , Madhavan Swaminathan , George Eugene White
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H05K1/03 ; H05K1/11 ; H05K3/40 ; H05K3/46 ; H01B13/00
摘要：
A device includes a ceramic substrate. A ceramic via is defined within the ceramic substrate at an actual location which differs from a designed desired location for the ceramic via. A minimal capture pad electrically communicates the actual location with the designed desired location. The minimal capture pad contains a ceramic via contact portion, a thin film stud contact portion, and a connecting portion; and each of the three is configured to be as small as permitted to limit the capacitances produced by the capture pad.
公开/授权文献
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