Invention Grant
- Patent Title: Multiple circuit board assembly having an interconnect mechanism that includes a flex connector
- Patent Title (中): 具有包括柔性连接器的互连机构的多电路板组件
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Application No.: US876376Application Date: 1997-06-16
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Publication No.: US5917709APublication Date: 1999-06-29
- Inventor: Dean A. Johnson , William R. Laubengayer , Stephen G. Richardson
- Applicant: Dean A. Johnson , William R. Laubengayer , Stephen G. Richardson
- Applicant Address: NY Rochester
- Assignee: Eastman Kodak Company
- Current Assignee: Eastman Kodak Company
- Current Assignee Address: NY Rochester
- Main IPC: H05K3/36
- IPC: H05K3/36 ; H05K1/11
Abstract:
A multiple circuit board assembly comprising: a first circuit board having a first predetermined set of conductive traces on a surface; a second circuit board having a second predetermined set of conductive traces on a surface; an interconnect mechanism having a third set of traces that mate the first and second set of traces when sandwiched between the first circuit board and the second circuit board in a predetermined manner; and fastened to the first and second circuit boards together with the interconnect mechanism sandwiched between such that there is electrical contact between the first and second predetermined set of conductive traces. The interconnect mechanism can be either single sided flex connector cable, double sided flex connector cable, or Cinch connectors. The fastening mechanism can be snaps fittings or screw setups without or without resilient washers.
Public/Granted literature
- US5383067A Control signal reproducing circuit Public/Granted day:1995-01-17
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