发明授权
US5922212A Semiconductor sensor having suspended thin-film structure and method for
fabricating thin-film structure body
失效
具有悬浮薄膜结构的半导体传感器和用于制造薄膜结构体的方法
- 专利标题: Semiconductor sensor having suspended thin-film structure and method for fabricating thin-film structure body
- 专利标题(中): 具有悬浮薄膜结构的半导体传感器和用于制造薄膜结构体的方法
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申请号: US663001申请日: 1996-06-07
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公开(公告)号: US5922212A公开(公告)日: 1999-07-13
- 发明人: Kazuhiko Kano , Kenichi Nara , Toshimasa Yamamoto , Nobuyuki Kato , Yoshitaka Gotoh , Yoshinori Ohtsuka , Kenichi Ao
- 申请人: Kazuhiko Kano , Kenichi Nara , Toshimasa Yamamoto , Nobuyuki Kato , Yoshitaka Gotoh , Yoshinori Ohtsuka , Kenichi Ao
- 申请人地址: JPX Kariya
- 专利权人: Nippondenso Co., Ltd
- 当前专利权人: Nippondenso Co., Ltd
- 当前专利权人地址: JPX Kariya
- 优先权: JPX7-142100 19950608; JPX7-142101 19950608; JPX7-142105 19950608
- 主分类号: B81B3/00
- IPC分类号: B81B3/00 ; B81C1/00 ; G01P15/08 ; G01P15/125 ; C23F1/00
摘要:
A semiconductor sensor having a thin-film structure body, in which thin-film structure is prevented from bending due to the internal stress distribution in the thickness direction, is disclosed. A silicon-oxide film is formed as a sacrificial layer on a silicon substrate, and a polycrystalline-silicon thin film is formed on the silicon-oxide film. Thereafter, phosphorus (P) is ion-implanted in the surface of the polycrystalline-silicon thin film, and thereby the surface state of the polycrystalline-silicon thin film is modified. A portion of distribution of stress existing in the thickness direction of the polycrystalline-silicon thin film is changed by this modification, and stress distribution is adjusted. By removal of the silicon-oxide film, a movable member of the polycrystalline-silicon thin film is disposed above the silicon substrate with a gap interposed therebetween.
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