发明授权
- 专利标题： Method of forming a moisture guard ring for integrated circuit applications
- 专利标题（中）： 形成用于集成电路应用的防潮环的方法
-
申请号： US947793申请日： 1997-10-09
-
公开(公告)号： US5926697A公开(公告)日： 1999-07-20
- 发明人: Dun-Nian Yaung , Shou-Gwo Wuu , Jin-Yuan Lee , Hsien Wei Chin
- 申请人： Dun-Nian Yaung , Shou-Gwo Wuu , Jin-Yuan Lee , Hsien Wei Chin
- 申请人地址： TWX Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TWX Hsin-Chu
- 主分类号： H01L21/02
- IPC分类号： H01L21/02 ; H01L21/761 ; H01L23/525 ; H01L21/76
摘要：
An improved and new structure and method for forming a guard ring in an integrated circuit having at least one level of polysilicon wiring has been developed. The guard ring is formed without necessitating additional manufacturing process steps and the guard ring is bonded to the semiconductor substrate, thereby providing a superior barrier to diffusion of moisture and contaminants from a window in the insulating layers to the semiconductor device regions.
公开/授权文献
- US5313896A System for embroidering machine 公开/授权日：1994-05-24