发明授权
- 专利标题： Apparatus for dissipating heat from a conductive layer in a circuit board
- 专利标题（中）： 用于从电路板中的导电层散热的装置
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申请号： US991957申请日： 1997-12-16
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公开(公告)号： US5933324A公开(公告)日： 1999-08-03
- 发明人: Joseph C. Barrett
- 申请人： Joseph C. Barrett
- 申请人地址： CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： CA Santa Clara
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H05K3/42 ; H05K7/20
摘要：
An apparatus for dissipating heat transferred to a circuit board. A board on which to mount an electronic device includes a conductive layer. A first board heat dissipation element is thermally coupled to the conductive layer and extends away from a surface of the board to dissipate heat from the conductive layer to the ambient.
公开/授权文献
- US5276925A Retractable urinal for toilet seat 公开/授权日：1994-01-11
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