Invention Grant
- Patent Title: Semiconductor integrated circuit device capable of achieving reductions in chip area and consumption power
- Patent Title (中): 半导体集成电路器件能够实现芯片面积和功耗的降低
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Application No.: US54893Application Date: 1998-04-03
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Publication No.: US5949139APublication Date: 1999-09-07
- Inventor: Koji Imura , Masaaki Tatsukawa , Koji Komatsu
- Applicant: Koji Imura , Masaaki Tatsukawa , Koji Komatsu
- Applicant Address: JPX Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JPX Osaka
- Priority: JPX9-108669 19970425; JPX9-132236 19970522; JPX9-132237 19970522; JPX9-132238 19970522
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/50 ; H01L25/065 ; H01L23/525 ; H01L27/08
Abstract:
This is provided a dual-surface mounting type semiconductor integrated circuit device capable of achieving reductions in chip area and consumption power. In the dual-surface mounting type semiconductor integrated circuit device, a specified circuit for implementing a function common to integrated circuit chips and mounted on both surfaces of a chip mounting section of a lead frame is provided only for the integrated circuit chip of one surface, and an output signal of the specified circuit provided only for the integrated circuit chip of this one surface is transmitted to the integrated circuit chip of the other surface via bonding wires and an internal lead.
Public/Granted literature
- USD386337S Diaper holder Public/Granted day:1997-11-18
Information query
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