公开(公告)号：US5949139A

公开(公告)日：1999-09-07

申请号：US54893

申请日：1998-04-03

Applicant: Koji Imura ,  Masaaki Tatsukawa ,  Koji Komatsu

Inventor： Koji Imura ,  Masaaki Tatsukawa ,  Koji Komatsu

IPC: H01L23/495 ,  H01L23/50 ,  H01L25/065 ,  H01L23/525 ,  H01L27/08

CPC classification number: H01L23/49575 ,  H01L23/50 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/12036 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041

Abstract: This is provided a dual-surface mounting type semiconductor integrated circuit device capable of achieving reductions in chip area and consumption power. In the dual-surface mounting type semiconductor integrated circuit device, a specified circuit for implementing a function common to integrated circuit chips and mounted on both surfaces of a chip mounting section of a lead frame is provided only for the integrated circuit chip of one surface, and an output signal of the specified circuit provided only for the integrated circuit chip of this one surface is transmitted to the integrated circuit chip of the other surface via bonding wires and an internal lead.

Abstract translation: 提供了一种能够实现芯片面积和功耗降低的双表面安装型半导体集成电路器件。 在双表面安装型半导体集成电路器件中，仅为一个表面的集成电路芯片提供用于实现集成电路芯片共同的功能并且安装在引线框架的芯片安装部分的两个表面上的指定电路， 并且仅为该一个表面的集成电路芯片提供的规定电路的输出信号通过接合线和内部引线传输到另一表面的集成电路芯片。