Invention Grant
US5953606A Method for manufacturing a TFT SRAM memory device with improved
performance
失效
制造具有改进性能的TFT SRAM存储器件的方法
- Patent Title: Method for manufacturing a TFT SRAM memory device with improved performance
- Patent Title (中): 制造具有改进性能的TFT SRAM存储器件的方法
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Application No.: US67151Application Date: 1998-02-27
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Publication No.: US5953606APublication Date: 1999-09-14
- Inventor: Kuo Ching Huang , Yean-Kuen Fang , Mong-Song Liang , Cheng-Yeh Shih , Dun Nian Yaung
- Applicant: Kuo Ching Huang , Yean-Kuen Fang , Mong-Song Liang , Cheng-Yeh Shih , Dun Nian Yaung
- Applicant Address: TWX Hsih-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TWX Hsih-Chu
- Main IPC: H01L21/8244
- IPC: H01L21/8244 ; H01L27/11
Abstract:
A method of forming a contact between a conductor and a substrate region in a MOSFET SRAM starts with forming a dielectric layer on the surface of a partially completed SRAM device with pass and latch transistors covering the transistors. Then, form a thin film gate electrode and an interconnect on the dielectric layer with a gate oxide layer covering the gate electrode and the interconnect; cover the gate oxide layer with a poly conductive layer. Then form a silicon oxide layer over the poly conductive layer and pattern the silicon oxide layer to form a silicon oxide channel mask over the poly conductive layer which is used to pattern the silicon oxide layer into a channel mask over the gate electrode. The channel mask is used for patterning the implanting of dopant into the poly conductive layer aside from the channel mask to form a source region, a drain region and an interconnect in the poly conductive layer. Then form a contact through the gate oxide layer between the interconnect and the poly conductive layer by forming a tungsten layer over the poly conductive layer aside from the channel mask which remains in place.
Public/Granted literature
- USD392846S Barbecue set Public/Granted day:1998-03-31
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