发明授权
- 专利标题： Automatic film deposition control
- 专利标题（中）： 自动膜沉积控制
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申请号： US896813申请日： 1997-07-18
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公开(公告)号： US5955139A公开(公告)日： 1999-09-21
- 发明人: Armando Iturralde
- 申请人： Armando Iturralde
- 申请人地址： NJ Park Ridge JPX Tokyo
- 专利权人： Sony Corporation,Sony Electronics Inc.
- 当前专利权人： Sony Corporation,Sony Electronics Inc.
- 当前专利权人地址： NJ Park Ridge JPX Tokyo
- 主分类号： C23C14/00
- IPC分类号： C23C14/00 ; C23C14/54 ; C23C16/52 ; B05D3/14 ; C23C14/34
摘要：
A film deposition control system and method in which a deposition rate monitor and an ellipsometer are used to control the thickness of a thin film being deposited on a wafer. The ellipsometer is also used to detect the refractive index of the thin film being deposited, and the detected refractive index value is used to control the ratio of the reactive gases being injected into the processing chamber.
公开/授权文献
- US5272956A Recoil gas system for rifle 公开/授权日：1993-12-28
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