发明授权
US5956594A Method for simultaneously forming capacitor plate and metal contact structures for a high density DRAM device 有权
同时形成用于高密度DRAM器件的电容器板和金属接触结构的方法

Method for simultaneously forming capacitor plate and metal contact
structures for a high density DRAM device
摘要:
A method for creating a DRAM device, featuring the simultaneous formation of a capacitor plate, used for a stacked capacitor structure, and the formation of a metal contact structure, and of a word line contact structure, has been developed. The process features the deposition of a barrier layer, and an overlying tungsten layer, on a storage node electrode, and with the deposition also completely filling a metal contact hole, and a word line hole. A patterning procedure, using an anisotropic RIE procedure, removes unwanted regions of tungsten and barrier layer, resulting in a capacitor plate, a metal contact structure, and a word line structure, all comprised of tungsten and the barrier layers, and all formed via one deposition procedure, and patterned using one RIE procedure.
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