发明授权
US5956594A Method for simultaneously forming capacitor plate and metal contact
structures for a high density DRAM device
有权
同时形成用于高密度DRAM器件的电容器板和金属接触结构的方法
- 专利标题: Method for simultaneously forming capacitor plate and metal contact structures for a high density DRAM device
- 专利标题(中): 同时形成用于高密度DRAM器件的电容器板和金属接触结构的方法
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申请号: US184345申请日: 1998-11-02
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公开(公告)号: US5956594A公开(公告)日: 1999-09-21
- 发明人: Fu-Liang Yang , Bi-Ling Chen , Erik S. Jeng
- 申请人: Fu-Liang Yang , Bi-Ling Chen , Erik S. Jeng
- 申请人地址: TWX Hsin-Chu
- 专利权人: Vanguard International Semiconductor Corporation
- 当前专利权人: Vanguard International Semiconductor Corporation
- 当前专利权人地址: TWX Hsin-Chu
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; H01L21/768 ; H01L21/8242 ; H01L21/20
摘要:
A method for creating a DRAM device, featuring the simultaneous formation of a capacitor plate, used for a stacked capacitor structure, and the formation of a metal contact structure, and of a word line contact structure, has been developed. The process features the deposition of a barrier layer, and an overlying tungsten layer, on a storage node electrode, and with the deposition also completely filling a metal contact hole, and a word line hole. A patterning procedure, using an anisotropic RIE procedure, removes unwanted regions of tungsten and barrier layer, resulting in a capacitor plate, a metal contact structure, and a word line structure, all comprised of tungsten and the barrier layers, and all formed via one deposition procedure, and patterned using one RIE procedure.
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