发明授权
- 专利标题: Modular EMC PCI card gasket
- 专利标题(中): 模块化EMC PCI卡片垫片
-
申请号: US877152申请日: 1997-06-17
-
公开(公告)号: US5957465A公开(公告)日: 1999-09-28
- 发明人: Daniel Derrick Gonsalves , Kenneth Kitlas , Robert Antonnucio , William Izzicupo , James Carney , Mark Pugliese , Joseph Spano , Mathew Palazola , David Desilets
- 申请人: Daniel Derrick Gonsalves , Kenneth Kitlas , Robert Antonnucio , William Izzicupo , James Carney , Mark Pugliese , Joseph Spano , Mathew Palazola , David Desilets
- 申请人地址: CA Mountain View
- 专利权人: Sun Microsystems, Inc.
- 当前专利权人: Sun Microsystems, Inc.
- 当前专利权人地址: CA Mountain View
- 主分类号: H05K9/00
- IPC分类号: H05K9/00 ; F16J15/02 ; H05K7/18
摘要:
A PCI card is inserted through an I/O opening in a computer panel. On one edge of the card is a cover from one end of which projects a tab. A resilient gasket is attached to the panel to create a flexible EMC seal around the opening. Preferably the gasket is formed of tin-plated beryllium copper. The gasket has alternate staggered spring fingers oriented opposite to the direction of insertion of the PCI card. To retain the gasket the panel is formed with slots at either end and an outward struck projection at the middle. The gasket is formed with a tongue at either end to be inserted in one of the slots and a punched-out opening to receive the projection.
公开/授权文献
- US5218613A Visible diode laser 公开/授权日:1993-06-08
信息查询