公开(公告)号：US5957465A

公开(公告)日：1999-09-28

申请号：US877152

申请日：1997-06-17

申请人： Daniel Derrick Gonsalves ,  Kenneth Kitlas ,  Robert Antonnucio ,  William Izzicupo ,  James Carney ,  Mark Pugliese ,  Joseph Spano ,  Mathew Palazola ,  David Desilets

发明人： Daniel Derrick Gonsalves ,  Kenneth Kitlas ,  Robert Antonnucio ,  William Izzicupo ,  James Carney ,  Mark Pugliese ,  Joseph Spano ,  Mathew Palazola ,  David Desilets

IPC分类号： H05K9/00 ,  F16J15/02 ,  H05K7/18

CPC分类号： H05K9/0016

摘要： A PCI card is inserted through an I/O opening in a computer panel. On one edge of the card is a cover from one end of which projects a tab. A resilient gasket is attached to the panel to create a flexible EMC seal around the opening. Preferably the gasket is formed of tin-plated beryllium copper. The gasket has alternate staggered spring fingers oriented opposite to the direction of insertion of the PCI card. To retain the gasket the panel is formed with slots at either end and an outward struck projection at the middle. The gasket is formed with a tongue at either end to be inserted in one of the slots and a punched-out opening to receive the projection.

摘要翻译： PCI卡通过计算机面板中的I / O开口插入。 在卡片的一个边缘是一个盖子，其一端投射一个标签。 弹性垫圈连接到面板上以在开口周围产生柔性的EMC密封。 优选地，垫圈由镀锡的铍铜形成。 垫圈具有与PCI卡插入方向相反的交替的交错弹簧指。 为了保持垫片，面板在两端形成有槽，在中间形成有向外的突起。 垫圈在任一端形成有舌片以插入其中一个狭槽中，并且具有冲孔开口以接收突出部。

公开(公告)号：US5839584A

公开(公告)日：1998-11-24

申请号：US871277

申请日：1997-06-09

申请人： Daniel Derrick Gonsalves ,  Robert Antonnucio ,  William Izzicupo ,  James Carney ,  Mark Pugliese ,  Joseph Spano ,  Mathew Palazola ,  David Desilets

发明人： Daniel Derrick Gonsalves ,  Robert Antonnucio ,  William Izzicupo ,  James Carney ,  Mark Pugliese ,  Joseph Spano ,  Mathew Palazola ,  David Desilets

IPC分类号： G06F1/18 ,  H05K7/14

CPC分类号： G06F1/184 ,  H05K7/1429

摘要： A structural foam, injection molded superstructure is attached to a motherboard by means of threaded inserts. The superstructure is formed with guide ways for CPU processor modules, and also for the edges of PCI cards. Features of the structure include cam levers on the CPU modules to install and extract the modules. A metal transverse vertical retaining bracket is attached to the superstructure to hold sides thereof parallel and prevent splaying of the free, open end of the superstructure upon extraction of CPU processor modules. The assembly provides stiffness to the motherboard.

摘要翻译： 结构泡沫，注射成型的上部结构通过螺纹插入件连接到母板。 上层结构由CPU处理器模块和PCI卡边缘构成。 结构特点包括CPU模块上的凸轮杆，用于安装和提取模块。 金属横向垂直固定支架连接到上层建筑物以保持其侧面平行，并且在提取CPU处理器模块时防止上层建筑的自由开放端部的展开。 组件为主板提供刚度。