发明授权
- 专利标题: Thermal transfer sheet and method for manufacturing same
- 专利标题(中): 热转印片及其制造方法
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申请号: US7567申请日: 1998-01-15
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公开(公告)号: US5958833A公开(公告)日: 1999-09-28
- 发明人: Shigeki Chujo , Junichi Hiroi , Nobuyuki Harada
- 申请人: Shigeki Chujo , Junichi Hiroi , Nobuyuki Harada
- 申请人地址: JPX Tokyo-to
- 专利权人: Dai Nippon Printing Co., Ltd.
- 当前专利权人: Dai Nippon Printing Co., Ltd.
- 当前专利权人地址: JPX Tokyo-to
- 优先权: JPX9-017705 19970117
- 主分类号: B41M5/382
- IPC分类号: B41M5/382 ; B41M5/40 ; B41M5/44 ; B41M5/035 ; B41M5/38
摘要:
A thermal transfer sheet of the present invention has a heat resistant layer disposed on a back surface thereof and a slip layer disposed on the heat resistant layer. The heat resistant layer contains a binder resin having a molecular structure, one end portion of which is an end group selected from the group consisting of hydroxyl, amino, carboxyl and mercapto. The slip layer contains silylisocyanate represented by the following formula (1): R.sub.n --Si--(N C O).sub.4-n �in the formula (1), R denotes alkyl, aryl or vinyl; and "n" denotes an integer of 0 to 3!. The slip layer is hardened by reacting an isocyanate group of the silylisocyanate contained therein with the end group of the binder resin contained in the heat resistant layer.
公开/授权文献
- US5316165A Foldable electrical component enclosures 公开/授权日:1994-05-31
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