A substrate rinsing apparatus of a non-contact type having a high rinsing ability. An ultrasonic rinsing nozzle and a high-pressure rinsing nozzle are both disposed within the same rinsing apparatus. The ultrasonic rinsing nozzle ejects ultrasonic rinsing liquid as a curtain through a slit, while the high-pressure rinsing nozzle ejects a high-pressure rinsing jet toward the ultrasonic rinsing liquid which is ejected toward a substrate. Not only is foreign matter removed by ultrasonic rinsing, but foregoing matter is removed by the high-pressure rinsing jet and is carried away by a flow of the ultrasonic rinsing liquid and washed off the substrate toward a downstream side of rotation of the substrate.