公开(公告)号：US5975098A

公开(公告)日：1999-11-02

申请号：US775712

申请日：1996-12-17

申请人： Mitsuaki Yoshitani ,  Kazuo Kinose ,  Satoru Tanaka ,  Kenya Morinishi ,  Masahiro Miyagi ,  Naoshige Itami ,  Kazuhiro Watanabe

发明人： Mitsuaki Yoshitani ,  Kazuo Kinose ,  Satoru Tanaka ,  Kenya Morinishi ,  Masahiro Miyagi ,  Naoshige Itami ,  Kazuhiro Watanabe

IPC分类号： B08B3/02 ,  B08B3/12 ,  G02F1/1333 ,  H01L21/00

CPC分类号： H01L21/67051 ,  B08B3/02 ,  B08B3/12 ,  B08B2203/0288 ,  G02F1/1333 ,  Y10S134/902

摘要： A substrate rinsing apparatus of a non-contact type having a high rinsing ability. An ultrasonic rinsing nozzle and a high-pressure rinsing nozzle are both disposed within the same rinsing apparatus. The ultrasonic rinsing nozzle ejects ultrasonic rinsing liquid as a curtain through a slit, while the high-pressure rinsing nozzle ejects a high-pressure rinsing jet toward the ultrasonic rinsing liquid which is ejected toward a substrate. Not only is foreign matter removed by ultrasonic rinsing, but foregoing matter is removed by the high-pressure rinsing jet and is carried away by a flow of the ultrasonic rinsing liquid and washed off the substrate toward a downstream side of rotation of the substrate.

摘要翻译： 具有高冲洗能力的非接触型衬底漂洗装置。 超声波清洗喷嘴和高压冲洗喷嘴均设置在同一冲洗装置内。 超声波冲洗喷嘴通过狭缝喷射超声波冲洗液体作为帘幕，同时高压冲洗喷嘴向朝向基板喷射的超声波冲洗液喷射高压冲洗喷嘴。 通过超声波冲洗除去异物，但是通过高压冲洗喷嘴除去上述物质，并且通过超声波冲洗液体的流动而被排出，从而将基板从基板的下游侧洗出。

公开(公告)号：US09165807B2

公开(公告)日：2015-10-20

申请号：US13401644

申请日：2012-02-21

申请人： Yoshiteru Fukutomi ,  Tsuyoshi Mitsuhashi ,  Hiroyuki Ogura ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

发明人： Yoshiteru Fukutomi ,  Tsuyoshi Mitsuhashi ,  Hiroyuki Ogura ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

IPC分类号： C23C16/00 ,  H01L21/67 ,  B05C13/00 ,  B05D3/04 ,  B05B15/12 ,  H01L23/34

CPC分类号： H01L21/67178 ,  B05B14/43 ,  B05B14/44 ,  B05C13/00 ,  B05C13/02 ,  B05D3/0486 ,  G03F7/26 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67225 ,  H01L23/34 ,  H01L2924/0002 ,  Y10S414/135 ,  H01L2924/00

摘要： A substrate treating apparatus includes a treating block including a plurality of cells arranged one over another. Each cell has treating units for treating substrates and a single main transport mechanism for transporting the substrates to the treating units. Each cell also has a blowout unit for supplying a clean gas into a transporting space of the main transport mechanism and an exhaust unit for exhausting gas from the transporting space. The blowout unit and the exhaust unit are arranged one over the other in the transporting space to separate the transporting space of each cell from that of another cell.

摘要翻译： 一种基板处理装置，包括处理块，该处理块包括多个彼此排列的单元。 每个电池具有用于处理基板的处理单元和用于将基板输送到处理单元的单个主输送机构。 每个电池还具有用于向主输送机构的输送空间供给清洁气体的吹出单元和用于从输送空间排出气体的排气单元。 喷出单元和排气单元在传送空间中彼此重叠配置，以将每个单元的传送空间与另一个单元的传送空间分开。

公开(公告)号：US20090142162A1

公开(公告)日：2009-06-04

申请号：US12324794

申请日：2008-11-26

申请人： Hiroyuki Ogura ,  Tsuyoshi Mitsuhashi ,  Yoshiteru Fukutomi ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

发明人： Hiroyuki Ogura ,  Tsuyoshi Mitsuhashi ,  Yoshiteru Fukutomi ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

IPC分类号： H01L21/67

CPC分类号： B05C13/00 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67225

摘要： The invention provides coating units, heat-treating units, and a first main transport mechanism for transporting substrates to each of these treating units. The substrates are transferred from the first main transport mechanism to a second main transport mechanism through a receiver. When a substrate cannot be placed on the receiver, this substrate is placed on a buffer. Thus, the first main transport mechanism can continue transporting other substrates. The other substrates in the treating units are transported between the treating units without delay, to receive a series of treatments including coating treatment and heat treatment as scheduled. This prevents lowering of the quality of treatment for forming film on the substrates.

摘要翻译： 本发明提供涂覆单元，热处理单元和用于将基底输送到这些处理单元中的每一个的第一主输送机构。 基板通过接收器从第一主输送机构传送到第二主输送机构。 当基板不能放置在接收器上时，将该基板放置在缓冲器上。 因此，第一主输送机构可以继续输送其它基板。 处理单元中的其它基材在处理单元之间没有延迟地输送，以接收包括涂覆处理和热处理的一系列处理。 这防止了在基板上形成膜的处理质量的降低。

公开(公告)号：US20090000543A1

公开(公告)日：2009-01-01

申请号：US12163951

申请日：2008-06-27

申请人： Yoshiteru Fukutomi ,  Tsuyoshi Mitsuhashi ,  Hiroyuki Ogura ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

发明人： Yoshiteru Fukutomi ,  Tsuyoshi Mitsuhashi ,  Hiroyuki Ogura ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

IPC分类号： B05C11/00 ,  B05C13/00

CPC分类号： H01L21/67178 ,  B05B14/43 ,  B05B14/44 ,  B05C13/00 ,  B05C13/02 ,  B05D3/0486 ,  G03F7/26 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67225 ,  H01L23/34 ,  H01L2924/0002 ,  Y10S414/135 ,  H01L2924/00

摘要： A substrate treating apparatus includes a plurality of substrate treatment lines arranged vertically. Each substrate treatment line has a plurality of main transport mechanisms arranged horizontally, and a plurality of treating units provided for each main transport mechanism for treating substrates. A series of treatments is carried out for the substrates, with each main transport mechanism transporting the substrates to the treating units associated therewith, and transferring the substrates to the other main transport mechanism horizontally adjacent thereto. The substrate treating apparatus realizes increased processing capabilities by treating the substrates in parallel through the substrate treatment lines.

摘要翻译： 基板处理装置包括垂直布置的多个基板处理线。 每个基板处理线具有水平布置的多个主传送机构，以及为每个用于处理基板的主传送机构设置的多个处理单元。 对于基板进行一系列处理，每个主传送机构将基板传送到与其相关联的处理单元，并将基板传送到与其水平相邻的另一主传送机构。 基板处理装置通过基板处理线平行地处理基板来实现增加的处理能力。

公开(公告)号：US20060102069A1

公开(公告)日：2006-05-18

申请号：US11256976

申请日：2005-10-25

申请人： Kentaro Tokuri ,  Kenya Morinishi ,  Masaki Iwami

发明人： Kentaro Tokuri ,  Kenya Morinishi ,  Masaki Iwami

IPC分类号： B05C13/00 ,  B05C13/02 ,  B05C11/02

CPC分类号： G03F7/162 ,  G03F7/3021 ,  H01L21/67051

摘要： An apparatus causes a substrate to rotate and supplies a treatment liquid to a substrate surface to make a treatment, without concern that a mixed substance is eluted from a cup in the use for a long time, or a thin film comes off from an inside wall surface to be contamination-causing substances even if the cup made of a water-repellent material for collecting a treatment liquid becomes hydrophilic. A cup 16 disposed to surround the sides and underside of a substrate W rotating while being held by a spin chuck 10, and serving to collect a treatment liquid diffused from the substrate to the surroundings, is made of a plastic material. Further, an inside wall surface of an upper-side cup part 24 of the cup 16, being a portion on which the treatment liquid having been diffused from the substrate impinges, is roughened to be a hydrophilic surface.

摘要翻译： 一种装置使基材旋转，并将处理液供给到基材表面进行处理，而不用担心长时间使用中的混合物质从杯中洗脱，或薄膜从内壁脱落 即使由用于收集处理液的防水材料制成的杯子变成亲水性，也是被污染物质的表面。 设置成围绕由旋转卡盘10保持的基板W的侧面和下侧设置并用于收集从基板扩散到周围的处理液体的杯16由塑料材料制成。 此外，杯16的上侧杯部24的内壁面是从基体射出的处理液在其上撞击的部分被粗糙化为亲水性表面。

公开(公告)号：US08851008B2

公开(公告)日：2014-10-07

申请号：US12163951

申请日：2008-06-27

申请人： Yoshiteru Fukutomi ,  Tsuyoshi Mitsuhashi ,  Hiroyuki Ogura ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

发明人： Yoshiteru Fukutomi ,  Tsuyoshi Mitsuhashi ,  Hiroyuki Ogura ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

IPC分类号： B05C13/00 ,  B05C5/00 ,  H01L21/31 ,  H01L21/00 ,  H01L21/67 ,  B05D5/12 ,  B05B15/12 ,  B05D3/04

CPC分类号： H01L21/67178 ,  B05B14/43 ,  B05B14/44 ,  B05C13/00 ,  B05C13/02 ,  B05D3/0486 ,  G03F7/26 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67225 ,  H01L23/34 ,  H01L2924/0002 ,  Y10S414/135 ,  H01L2924/00

摘要： A substrate treating apparatus includes a plurality of substrate treatment lines arranged vertically. Each substrate treatment line has a plurality of main transport mechanisms arranged horizontally, and a plurality of treating units provided for each main transport mechanism for treating substrates. A series of treatments is carried out for the substrates, with each main transport mechanism transporting the substrates to the treating units associated therewith, and transferring the substrates to the other main transport mechanism horizontally adjacent thereto. The substrate treating apparatus realizes increased processing capabilities by treating the substrates in parallel through the substrate treatment lines.

摘要翻译： 基板处理装置包括垂直布置的多个基板处理线。 每个基板处理线具有水平布置的多个主传送机构，以及为每个用于处理基板的主传送机构设置的多个处理单元。 对于基板进行一系列处理，每个主传送机构将基板传送到与其相关联的处理单元，并将基板传送到与其水平相邻的另一主传送机构。 基板处理装置通过基板处理线平行地处理基板来实现增加的处理能力。

公开(公告)号：US20090165711A1

公开(公告)日：2009-07-02

申请号：US12343302

申请日：2008-12-23

申请人： Hiroyuki Ogura ,  Tsuyoshi Mitsuhashi ,  Yoshiteru Fukutomi ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

发明人： Hiroyuki Ogura ,  Tsuyoshi Mitsuhashi ,  Yoshiteru Fukutomi ,  Kenya Morinishi ,  Yasuo Kawamatsu ,  Hiromichi Nagashima

IPC分类号： B05C11/00

CPC分类号： H01L21/67745 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/67276 ,  H01L21/67754 ,  H01L21/6776

摘要： A treating section has substrate treatment lines arranged one over the other for treating substrates while transporting the substrates substantially horizontally. An IF section transports the substrates fed from each substrate treatment line to an exposing machine provided separately from this apparatus. The substrates are transported to the exposing machine in the order in which the substrates are loaded into the treating section. The throughput of this apparatus can be improved greatly, without increasing the footprint, since the substrate treatment lines are arranged one over the other. Each substrate can be controlled easily since the order of the substrates transported to the exposing machine is in agreement with the order of the substrates loaded into the treating section.

摘要翻译： 一个处理部分具有一个相互排列的衬底处理线，用于处理衬底，同时基本上水平地传送衬底。 IF部分将从每个基板处理线馈送的基板输送到与该装置分开设置的曝光机。 将基板按照将基板装入处理部的顺序输送到曝光机。 由于基板处理线彼此排列，因此能够大大提高该装置的生产量，而不增加占用面积。 可以容易地控制每个基板，因为输送到曝光机的基板的顺序与装载到处理部中的基板的顺序一致。

公开(公告)号：US07311781B2

公开(公告)日：2007-12-25

申请号：US11256976

申请日：2005-10-25

申请人： Kentaro Tokuri ,  Kenya Morinishi ,  Masaki Iwami

发明人： Kentaro Tokuri ,  Kenya Morinishi ,  Masaki Iwami

IPC分类号： B05B15/04 ,  B05C11/02

CPC分类号： G03F7/162 ,  G03F7/3021 ,  H01L21/67051

摘要： An apparatus causes a substrate to rotate and supplies a treatment liquid to a substrate surface to make a treatment, without concern that a mixed substance is eluted from a cup in the use for a long time, or a thin film comes off from an inside wall surface to be contamination-causing substances even if the cup made of a water-repellent material for collecting a treatment liquid becomes hydrophilic. A cup 16 disposed to surround the sides and underside of a substrate W rotating while being held by a spin chuck 10, and serving to collect a treatment liquid diffused from the substrate to the surroundings, is made of a plastic material. Further, an inside wall surface of an upper-side cup part 24 of the cup 16, being a portion on which the treatment liquid having been diffused from the substrate impinges, is roughened to be a hydrophilic surface.

摘要翻译： 一种装置使基材旋转，并将处理液供给到基材表面进行处理，而不用担心长时间使用中的混合物质从杯中洗脱，或薄膜从内壁脱落 即使由用于收集处理液的防水材料制成的杯子变成亲水性，也是被污染物质的表面。 设置成围绕由旋转卡盘10保持的基板W的侧面和下侧设置并用于收集从基板扩散到周围的处理液体的杯16由塑料材料制成。 此外，杯16的上侧杯部24的内壁面是从基体射出的处理液在其上撞击的部分被粗糙化为亲水性表面。

公开(公告)号：US07267130B2

公开(公告)日：2007-09-11

申请号：US10836283

申请日：2004-05-03

申请人： Seiichiro Okuda ,  Hiroaki Sugimoto ,  Takuya Kuroda ,  Masanobu Sato ,  Sadao Hirae ,  Shuichi Yasuda ,  Kenya Morinishi ,  Masayoshi Imai

发明人： Seiichiro Okuda ,  Hiroaki Sugimoto ,  Takuya Kuroda ,  Masanobu Sato ,  Sadao Hirae ,  Shuichi Yasuda ,  Kenya Morinishi ,  Masayoshi Imai

IPC分类号： B08B3/02

CPC分类号： H01L21/67046 ,  B08B1/04 ,  B08B3/02 ,  B08B2203/0288 ,  H01L21/67051 ,  Y10S134/902

摘要： The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.

摘要翻译： 基板处理装置设置有气液混合喷嘴，用于通过混合液体和加压气体来产生处理液雾，以将处理液雾以高速排放到基板。 液体可以是去除液体，中间漂洗液体或去离子水。 在蚀刻过程中在基板上产生的反应产物随着雾的流动以高速度被去除，从而提高了工艺的质量。

公开(公告)号：US06951221B2

公开(公告)日：2005-10-04

申请号：US09957652

申请日：2001-09-21

申请人： Seiichiro Okuda ,  Hiroaki Sugimoto ,  Takuya Kuroda ,  Masanobu Sato ,  Sadao Hirae ,  Shuichi Yasuda ,  Kenya Morinishi ,  Masayoshi Imai

发明人： Seiichiro Okuda ,  Hiroaki Sugimoto ,  Takuya Kuroda ,  Masanobu Sato ,  Sadao Hirae ,  Shuichi Yasuda ,  Kenya Morinishi ,  Masayoshi Imai

IPC分类号： B08B1/04 ,  B08B3/02 ,  H01L21/00

CPC分类号： H01L21/67046 ,  B08B1/04 ,  B08B3/02 ,  B08B2203/0288 ,  H01L21/67051 ,  Y10S134/902

摘要： The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.

摘要翻译： 基板处理装置设置有气液混合喷嘴，用于通过混合液体和加压气体来产生处理液雾，以将处理液雾以高速排放到基板。 液体可以是去除液体，中间漂洗液体或去离子水。 在蚀刻过程中在基板上产生的反应产物随着雾的流动以高速度被去除，从而提高了工艺的质量。