In a method for forming redundant signal traces and corresponding electronic components, a photoresist pattern which defines a semi-additive signal image is coated on at least one first conductive layer of a composite base substrate. A barrier layer of etch-resistant metal is deposited on the first conductive layer. The photoresist is removed, thereby forming a first barrier signal trace having a first line width. Optionally, one or more vias may be formed in the substrate. A surface conductive layer is deposited on the first conductive layer, the barrier layer, and on a surface of the optional vias. A photoresist pattern is coated on the surface conductive layer which defines a subtractive signal image. Predetermined portions of the surface conductive layer and the first conductive layer are removed. The photoresist is removed forming a second signal trace in overlying relationship with the first barrier signal trace and having a second line width greater than the first line width.