Invention Grant
- Patent Title: Laminated multilayer substrates
- Patent Title (中): 层叠多层基板
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Application No.: US115575Application Date: 1998-07-14
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Publication No.: US5986339APublication Date: 1999-11-16
- Inventor: Deepak K. Pai , Ronald R. Denny , Jeanne M. Chevalier , George F. Schwartz, III , Clark F. Webster , Robert M. Lufkin , Terrance A. Krinke
- Applicant: Deepak K. Pai , Ronald R. Denny , Jeanne M. Chevalier , George F. Schwartz, III , Clark F. Webster , Robert M. Lufkin , Terrance A. Krinke
- Applicant Address: VA Falls Church
- Assignee: General Dynamics Information Systems, Inc.
- Current Assignee: General Dynamics Information Systems, Inc.
- Current Assignee Address: VA Falls Church
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K3/00 ; H05K3/46 ; H01L23/053 ; H01L23/48
Abstract:
A multilayer package includes a plurality of interconnected large-layer-count (LLC) substrates. The LLC substrates each include conductive pads on the top and bottom surfaces of the substrate, a via in the substrate including conductive material to contact the pads on the top and bottom surfaces, and a post on a pad over the via. The posts of the substrates confront and abut each other, and are electrically bonded together. A non-flowable adhesive film mechanically bonds the LLC substrates, and has an aperture receiving the posts of the substrates.
Public/Granted literature
- US5308082A Soccer net storage compartment Public/Granted day:1994-05-03
Information query
