公开(公告)号：US5986339A

公开(公告)日：1999-11-16

申请号：US115575

申请日：1998-07-14

申请人： Deepak K. Pai ,  Ronald R. Denny ,  Jeanne M. Chevalier ,  George F. Schwartz, III ,  Clark F. Webster ,  Robert M. Lufkin ,  Terrance A. Krinke

发明人： Deepak K. Pai ,  Ronald R. Denny ,  Jeanne M. Chevalier ,  George F. Schwartz, III ,  Clark F. Webster ,  Robert M. Lufkin ,  Terrance A. Krinke

IPC分类号： H05K1/11 ,  H05K3/00 ,  H05K3/46 ,  H01L23/053 ,  H01L23/48

CPC分类号： H05K3/462 ,  H01L2224/81894 ,  H05K1/113 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/063 ,  H05K2203/1572 ,  H05K3/0094 ,  H05K3/4623 ,  H05K3/4647

摘要： A multilayer package includes a plurality of interconnected large-layer-count (LLC) substrates. The LLC substrates each include conductive pads on the top and bottom surfaces of the substrate, a via in the substrate including conductive material to contact the pads on the top and bottom surfaces, and a post on a pad over the via. The posts of the substrates confront and abut each other, and are electrically bonded together. A non-flowable adhesive film mechanically bonds the LLC substrates, and has an aperture receiving the posts of the substrates.

摘要翻译： 多层封装包括多个互连的大层数（LLC）衬底。 LLC基板各自包括在基板的顶表面和底表面上的导电焊盘，衬底中的通孔包括用于接触顶表面和底表面上的焊盘的导电材料，以及在通孔上的焊盘上的柱。 基板的支柱彼此面对并相互抵接，并电连接在一起。 不可流动的粘合膜将LLC基底机械地结合，并且具有接收基底的柱的孔。

公开(公告)号：US5786238A

公开(公告)日：1998-07-28

申请号：US799128

申请日：1997-02-13

申请人： Deepak K. Pai ,  Ronald R. Denny ,  Jeanne M. Chevalier ,  George F. Schwartz, III ,  Clark F. Webster ,  Robert M. Lufkin ,  Terrance A. Krinke

发明人： Deepak K. Pai ,  Ronald R. Denny ,  Jeanne M. Chevalier ,  George F. Schwartz, III ,  Clark F. Webster ,  Robert M. Lufkin ,  Terrance A. Krinke

IPC分类号： H05K1/11 ,  H05K3/00 ,  H05K3/46 ,  H01L21/44

CPC分类号： H05K3/462 ,  H01L2224/81894 ,  H05K1/113 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/063 ,  H05K2203/1572 ,  H05K3/0094 ,  H05K3/4623 ,  H05K3/4647

摘要： A process of laminating a large-layer-count (LLC) substrates includes formation of first and second vias through respective substrates. A conductive path is formed through each of the respective vias, and posts are formed on the respective vias, electrically connected to the respective conductive path. A non-flowable adhesive layer having an aperture is provided between the LLC substrates so that the posts confront each other through the aperture. The LLC substrates are pressed together through the non-flowable adhesive layer to mechanically bond them together, and so that the posts abut each other. Simultaneously, the posts are electrically bonded to each other in the aperture.

摘要翻译： 层叠大层数（LLC）衬底的工艺包括通过各自的衬底形成第一和第二过孔。 通过各个通孔中的每一个形成导电路径，并且在相应的通路上形成柱，电连接到相应的导电路径。 具有孔的不可流动的粘合剂层设置在LLC衬底之间，使得柱通过孔彼此面对。 LLC基底通过不可流动的粘合剂层压在一起，以将它们机械地结合在一起，使得柱彼此邻接。 同时，孔在孔中彼此电接合。