发明授权
US6005531A Antenna assembly including dual channel microwave transmit/receive
modules
失效
天线组件包括双通道微波发射/接收模块
- 专利标题: Antenna assembly including dual channel microwave transmit/receive modules
- 专利标题(中): 天线组件包括双通道微波发射/接收模块
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申请号: US158827申请日: 1998-09-23
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公开(公告)号: US6005531A公开(公告)日: 1999-12-21
- 发明人: John W. Cassen , Gary N. Bonadies , Patrick K. Richard , David A. Herlihy , Ayn U. Fuller , Daniel H. Wenzlick , Richard C. Kapraun , Mark R. Schrote , Kerry M. Yon , H. Halley Lisle, IV , Toby Hess , Edward L. Rich, III , George T. Hall , Brian T. Drude
- 申请人: John W. Cassen , Gary N. Bonadies , Patrick K. Richard , David A. Herlihy , Ayn U. Fuller , Daniel H. Wenzlick , Richard C. Kapraun , Mark R. Schrote , Kerry M. Yon , H. Halley Lisle, IV , Toby Hess , Edward L. Rich, III , George T. Hall , Brian T. Drude
- 申请人地址: CA Los Angeles
- 专利权人: Northrop Grumman Corporation
- 当前专利权人: Northrop Grumman Corporation
- 当前专利权人地址: CA Los Angeles
- 主分类号: H01Q3/26
- IPC分类号: H01Q3/26 ; G01S7/03 ; H01Q21/00 ; H01Q21/06
摘要:
An antenna assembly for an active electronically scanned array includes, among other things: an array of antenna elements; an RF signal feed and circulator assembly coupled to said antenna elements and forming thereby an array of radiating structures; a generally planar RF manifold assembly having regularly spaced openings therein located behind and normal to the radiating structures; an array of T/R modules connected to the array of radiating structures and having respective RF connector assemblies forming a portion of an RF interface at one end portion of each of the modules which project upwardly through said spaced openings in the RF manifold and wherein the respective connector assemblies thereof connect to at least one immediately adjacent circulator as well as to transmit and receive manifold portions of the RF manifold; each of the T/R modules further have a heat sink plate on the back side thereof which is positioned against one of a number of elongated liquid coolant circulating coldplates connected to a coolant distribution manifold encircling the array; a DC power and logic signal distribution manifold; and, a plurality of elongated DC/logic circuit board members connected to the DC power and logic signal distribution manifold and being respectively located adjacent and coextensive with a respective coldplate for supplying DC power and logic control signals to a DC/logic interface located at the other end portion of the respective modules.
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