- 专利标题： Solder bonding printed circuit boards
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申请号： US41157申请日： 1998-03-12
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公开(公告)号： US6013877A公开(公告)日： 2000-01-11
- 发明人: Yinon Degani , King Lien Tai
- 申请人： Yinon Degani , King Lien Tai
- 申请人地址： NJ Murray Hill
- 专利权人： Lucent Technologies Inc.
- 当前专利权人： Lucent Technologies Inc.
- 当前专利权人地址： NJ Murray Hill
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/12 ; H01L23/498 ; H05K1/18 ; H05K3/34 ; H01R9/09
摘要：
The specification describes techniques for attaching double sided circuit boards having plated through holes to interconnection substrates using solder bump arrays. The through holes are filled with a high melting point solder which allows solder bumps to be located directly on the through hole thus saving board area and reducing the interconnection length.
公开/授权文献
- USD383164S Hanger for plans 公开/授权日：1997-09-02
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