A method of forming the FEM cell semi-conductor structure includes forming a device area for the ferroelectric memory (FEM) gate unit on a silicon substrate. Appropriate impurities are implanted into the device area to form conductive channels, for use as a source junction region, a gate junction region and a drain junction region. A FEM cell includes a FEM gate unit formed on the substrate. A gate junction region is formed between the source junction region and the drain junction region for the FEM gate unit on the FEM gate unit device area, which FEM gate unit includes a lower metal layer, a ferroelectric (FE) layer, and an upper metal layer. A shallow junction layer is formed between the FEM gate unit and the gate junction region, as another conductive channel, which extends into the drain junction region. The FEM gate unit is spaced apart from the source region and the drain region, as is the conductive channel between the FEM gate unit and the gate junction region. Formation of the various conductive channels may take place at various stages of the manufacture, depending on what other devices are built on the substrate, and depending on the efficiencies of the various orders of construction. The structure of the FEM cell semiconductor includes a substrate, which may be a bulk silicon substrate or an SOI-type substrate. Conductive channels of two types are located above the substrate.