发明授权
- 专利标题： Method for coupling substrates and structure
- 专利标题（中）： 耦合衬底和结构的方法
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申请号： US654466申请日： 1996-05-28
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公开(公告)号： US6022761A公开(公告)日： 2000-02-08
- 发明人: Melissa E. Grupen-Shemansky , Jong-Kai Lin , Theodore G. Tessier
- 申请人： Melissa E. Grupen-Shemansky , Jong-Kai Lin , Theodore G. Tessier
- 申请人地址： IL Schaumburg
- 专利权人： Motorola, Inc.
- 当前专利权人： Motorola, Inc.
- 当前专利权人地址： IL Schaumburg
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H01L21/60 ; H01L23/485 ; H01L23/498 ; H05K1/14 ; H05K3/36 ; H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
A method for connecting substrates includes using an adhesive interposer structure (11) to bond a semiconductor device (26) to a substrate (18). The adhesive interposer structure (11) includes a non-conductive adhesive laminant (12) and conductive adhesive bumps (13). The conductive adhesive bumps (13) provide a conductive path between conductive bumps (27) on the semiconductor device (26) and conductive metal pads (21) located on the substrate (18). In an alternative embodiment, a conductive adhesive material (34) is screen or stencil printed into vias (39) located on a printed circuit board (38) to form conductive adhesive bumps (33). A non-conductive adhesive (52) is then screen or stencil printed onto the printed circuit board (38) adjacent the conductive adhesive bumps (33). A semiconductor die is then connected to the structure.