发明授权
- 专利标题： Semiconductor device having terminals for heat radiation
- 专利标题（中）： 具有用于散热的端子的半导体器件
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申请号： US591732申请日： 1996-01-25
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公开(公告)号： US6023098A公开(公告)日： 2000-02-08
- 发明人: Yutaka Higashiguchi , Mitsuo Inagaki , Toshio Kumai , Ryoichi Ochiai , Makoto Totani
- 申请人： Yutaka Higashiguchi , Mitsuo Inagaki , Toshio Kumai , Ryoichi Ochiai , Makoto Totani
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX7-164224 19950629
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L23/13 ; H01L23/34 ; H01L23/36 ; H01L23/367 ; H01L23/498
摘要：
A semiconductor device includes a wiring board, an electronic component supported by the wiring board, a heat conduction layer provided in the wiring board so as to be in contact with the electronic component, and terminals provided on the wiring board and thermally connected to the heat conduction layer through thermal vias provided in the wiring board. Heat generated by the electronic component conducts to the terminals through the heat conduction layer and then conducts to a circuit board on which the semiconductor device is placed.
公开/授权文献
- US4583351A Automatic case packing apparatus 公开/授权日：1986-04-22
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